BenutzerhandbuchInhaltsverzeichnisSPRS293A - TMS320C6712D1features1Table of Contents2REVISION HISTORY3GDP and ZDP BGA package (bottom view)5description6device characteristics7device compatibility8functional block and CPU (DSP core) diagram9CPU (DSP core) description10memory map summary12peripheral register descriptions13signal groups description18DEVICE CONFIGURATIONS20device configurations at device reset20DEVCFG register description22TERMINAL FUNCTIONS23Terminal Functions24development support36Software Development Tools:36Hardware Development Tools:36device support37device and development-support tool nomenclature37TMX37TMP37TMS37TMDX37TMDS37documentation support39CPU CSR register description40cache configuration (CCFG) register description42interrupt sources and interrupt selector43EDMA module and EDMA selector44ESEL0 Register (0x01A0 FF00)45ESEL1 Register (0x01A0 FF04)45ESEL3 Register (0x01A0 FF0C)45PLL and PLL controller46PLLCSR Register (0x01B7 C100)49PLLM Register (0x01B7 C110)50Table 29. PLL Multiplier Control Register (PLLM)50PLLDIV0, PLLDIV1, PLLDIV2, and PLLDIV3 Registers51OSCDIV1 Register (0x01B7 C124)52general-purpose input/output (GPIO)53power-down mode logic54triggering, wake-up, and effects54power-supply sequencing56system-level design considerations56power-supply design considerations56power-supply decoupling57IEEE 1149.1 JTAG compatibility statement58EMIF device speed59EMIF big endian mode correctness60bootmode60reset60absolute maximum ratings over operating case temperature range (unless otherwise noted)†61recommended operating conditions61electrical characteristics over recommended ranges of supply voltage and operating case temperature† ( unless otherwise noted)62PARAMETER MEASUREMENT INFORMATION63signal transition levels63AC transient rise/fall time specifications64timing parameters and board routing analysis65INPUT AND OUTPUT CLOCKS67timing requirements for CLKIN†‡§ (see Figure 21)67switching characteristics over recommended operating conditions for CLKOUT2‡§ (see Figure 22)67switching characteristics over recommended operating conditions for CLKOUT3†‡ ( see Figure 23)68timing requirements for ECLKIN§ (see Figure 24)68switching characteristics over recommended operating conditions for ECLKOUT†‡§ (see Figure 25)69ASYNCHRONOUS MEMORY TIMING70timing requirements for asynchronous memory cycles†‡ (see Figure 26-Figure 27)70switching characteristics over recommended operating conditions for asynchronous memory cycles‡§¶ (see Figure 26-Figure 27)70SYNCHRONOUS-BURST MEMORY TIMING73timing requirements for synchronous-burst SRAM cycles† (see Figure 28)73switching characteristics over recommended operating conditions for synchronous-burst SRAM cycles†‡ ( see Figure 28 and Figure 29)73SYNCHRONOUS DRAM TIMING75timing requirements for synchronous DRAM cycles† (see Figure 30)75switching characteristics over recommended operating conditions for synchronous DRAM cycles†‡ ( see Figure 30- Figure 36)75HOLD\/HOLDA\ TIMING81timing requirements for the HOLD\/HOLDA\ cycles† (see Figure 37)81switching characteristics over recommended operating conditions for the HOLD\/HOLDA\ cycles†‡ ( see Figure 37)81BUSREQ TIMING82switching characteristics over recommended operating conditions for the BUSREQ cycles ( see Figure 38)82RESET TIMING83timing requirements for reset†‡ (see Figure 39)83switching characteristics over recommended operating conditions during reset¶ (see Figure 39)83EXTERNAL INTERRUPT TIMING85timing requirements for external interrupts† (see Figure 40)85MULTICHANNEL BUFFERED SERIAL PORT TIMING86timing requirements for McBSP†‡ ( see Figure 41)86switching characteristics over recommended operating conditions for McBSP†‡ (see Figure 41)87timing requirements for FSR when GSYNC = 1 (see Figure 42)89timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 0†‡ (see Figure 43)89switching characteristics over recommended operating conditions for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 0†‡ ( see Figure 43)90timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 0†‡ (see Figure 44)90switching characteristics over recommended operating conditions for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 0†‡ ( see Figure 44)91timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 1†‡ (see Figure 45)92switching characteristics over recommended operating conditions for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 1†‡ ( see Figure 45)92timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 1†‡ (see Figure 46)93switching characteristics over recommended operating conditions for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 1†‡ ( see Figure 46)93TIMER TIMING95timing requirements for timer inputs† (see Figure 47)95switching characteristics over recommended operating conditions for timer outputs† ( see Figure 47)95GENERAL-PURPOSE INPUT/OUTPUT (GPIO) PORT TIMING96timing requirements for GPIO inputs†‡ (see Figure 48)96switching characteristics over recommended operating conditions for GPIO outputs†§ (see Figure 48)96JTAG TEST-PORT TIMING97timing requirements for JTAG test port (see Figure 49)97switching characteristics over recommended operating conditions for JTAG test port ( see Figure 49)97MECHANICAL DATA98package thermal resistance characteristics98thermal resistance characteristics (S-PBGA package) for GDP98thermal resistance characteristics (S-PBGA package) for ZDP98packaging information98Größe: 1,37 MBSeiten: 102Language: EnglishHandbuch öffnen