Intel L5530 AT80602002937AB User Manual
Product codes
AT80602002937AB
Thermal Specifications
102
Intel
®
Xeon
®
Processor 5500 Series Datasheet, Volume 1
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based on initial silicon characterization. These specifications may be further
updated as more characterization data becomes available.
4.
Power specifications are defined at all VIDs found in
. The Intel Xeon Processor L5508 may be
shipped under multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
6.1.2
Thermal Metrology
The minimum and maximum case temperatures (T
CASE
) are specified in
through
integrated heat spreader (IHS).
illustrates the location where T
CASE
temperature measurements should be made. For detailed guidelines on temperature
measurement methodology, refer to the Intel® Xeon® Processor 5500/5600 Series
Thermal / Mechanical Design Guide.
measurement methodology, refer to the Intel® Xeon® Processor 5500/5600 Series
Thermal / Mechanical Design Guide.
Notes:
1.
Figure is not to scale and is for reference only.
2.
B1: Max = 45.07 mm, Min = 44.93 mm.
3.
B2: Max = 42.57 mm, Min = 42.43 mm.
4.
C1: Max = 39.1 mm, Min = 38.9 mm.
5.
C2: Max = 36.6 mm, Min = 36.4 mm.
6.
C3: Max = 2.3 mm, Min = 2.2 mm
7.
C4: Max = 2.3 mm, Min = 2.2 mm.
Figure 6-7. Case Temperature (T
CASE
) Measurement Location