Sony mz-dh10p User Manual
MZ-DH10P
3
TABLE OF CONTENTS
1.
SERVICING NOTES
...............................................
4
2.
GENERAL
...................................................................
5
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
6
3-2.
Panel (Bottom) Block ......................................................
7
3-3.
Camera Module ...............................................................
7
3-4.
MAIN Board ....................................................................
8
3-5.
Panel (Upper) Block ........................................................
8
3-6.
Ornamental Belt ..............................................................
9
3-7.
Mechanism Deck (MT-MZDH10P-181),
Battery Case ....................................................................
Battery Case ....................................................................
9
3-8.
Gear (SA), Gear (SB) ...................................................... 10
3-9.
OP Service Assy .............................................................. 10
3-10. DC Motor SSM18D/C-NP (Spindle) (M701),
DC Motor SSM21A/C-NP (Sled) (M702),
DC Motor Unit (Over Write Head Up/Down) (M703) ... 11
DC Motor Unit (Over Write Head Up/Down) (M703) ... 11
3-11. Holder Assy ..................................................................... 11
3-12. Position Of Ferrite Core .................................................. 12
3-12. Position Of Ferrite Core .................................................. 12
4.
TEST MODE
.............................................................. 13
5.
ELECTRICAL ADJUSTMENTS
.......................... 17
6.
DIAGRAMS
6-1.
Block Diagram – MD SERVO Section – ........................ 21
6-2.
Block Diagram – AUDIO/CAMERA Section – .............. 22
6-3.
Block Diagram – POWER SUPPLY Section – ............... 23
6-4.
Schematic Diagram – MAIN Board (1/9) – .................... 25
6-5.
Schematic Diagram – MAIN Board (2/9) – .................... 26
6-6.
Schematic Diagram – MAIN Board (3/9) – .................... 27
6-7.
Schematic Diagram – MAIN Board (4/9) – .................... 28
6-8.
Schematic Diagram – MAIN Board (5/9) – .................... 29
6-9.
Schematic Diagram – MAIN Board (6/9) – .................... 30
6-10. Schematic Diagram – MAIN Board (7/9) – .................... 31
6-11. Schematic Diagram – MAIN Board (8/9) – .................... 32
6-12. Schematic Diagram – MAIN Board (9/9) – .................... 33
6-13. Printed Wiring Board
6-11. Schematic Diagram – MAIN Board (8/9) – .................... 32
6-12. Schematic Diagram – MAIN Board (9/9) – .................... 33
6-13. Printed Wiring Board
– MAIN Board (Component Side) – ............................... 34
6-14. Printed Wiring Board
– MAIN Board (Conductor Side) – ................................. 35
6-15. Printed Wiring Boards – PANEL Section – ..................... 36
6-16. Schematic Diagram – PANEL Section – ......................... 37
6-16. Schematic Diagram – PANEL Section – ......................... 37
7.
EXPLODED VIEWS
7-1.
Overall Section ................................................................ 51
7-2.
Panel (Upper) Section ..................................................... 52
7-3.
Chassis Section ................................................................ 53
7-4.
Mechanism Deck Section (MT-MZDH10P-181) ............ 54
8.
ELECTRICAL PARTS LIST
................................ 55
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
/N
s
CRADLE