Intel N450 AU80610004653AA User Manual
Product codes
AU80610004653AA
Datasheet
41
Electrical Specifications
4.8
Test Access Port (TAP) Connection
Due to the voltage levels supported by other components in the Test Access Port (TAP)
logic, Intel recommends the processor be first in the TAP chain, followed by any other
components within the system. A translation buffer should be used to connect to the
rest of the chain unless one of the other components is capable of accepting an input of
the appropriate voltage. Two copies of each signal may be required with each driving a
different voltage level.
logic, Intel recommends the processor be first in the TAP chain, followed by any other
components within the system. A translation buffer should be used to connect to the
rest of the chain unless one of the other components is capable of accepting an input of
the appropriate voltage. Two copies of each signal may be required with each driving a
different voltage level.
4.9
Absolute Maximum and Minimum Ratings
specifies absolute maximum and minimum ratings. At conditions outside
functional operation condition limits, but within absolute maximum and minimum
ratings, neither functionality nor long-term reliability can be expected. If a device is
returned to conditions within functional operation limits after having been subjected to
conditions outside these limits (but within the absolute maximum and minimum
ratings) the device may be functional, but with its lifetime degraded depending on
exposure to conditions exceeding the functional operation condition limits.
ratings, neither functionality nor long-term reliability can be expected. If a device is
returned to conditions within functional operation limits after having been subjected to
conditions outside these limits (but within the absolute maximum and minimum
ratings) the device may be functional, but with its lifetime degraded depending on
exposure to conditions exceeding the functional operation condition limits.
Although the processor contains protective circuitry to resist damage from Electro-
Static Discharge (ESD), precautions should always be taken to avoid high static
voltages or electric fields
Static Discharge (ESD), precautions should always be taken to avoid high static
voltages or electric fields
Table 4-20.Processor Absolute Minimum and Maximum Ratings (Sheet 1 of 2)
Symbol
Parameter
Min
Max
Unit
Notes
1, 2
V
CC
, V
CCP
Processor Core, LGI voltages
with respect to V
with respect to V
SS
-0.3
1.45
V
6
V
CCSM,
V
CCCK_DDR
Processor DDR voltage with
respect to V
respect to V
SS
-0.3
2.25
V
V
CCA
Processor PLL voltage with
respect to V
respect to V
SS
-0.3
2.25
V
V
CCGFX
Processor GFX voltage with
respect to V
respect to V
SS
-0.3
1.55
V
V
CCLVDS
Processor LVDS voltage with
respect to V
respect to V
SS
-0.3
2.25
V
V
CCA_DDR,
V
CCACK_DDR
Processor DDR PLL voltage
with respect to V
with respect to V
SS
-0.3
1.45
V
V
CCRING_EAST,
V
CCRING_WEST,
V
CC_LGI_VID,
Processor DAC, LGIO, LVDS, &
LGIO voltage with respect to
V
LGIO voltage with respect to
V
SS
-0.3
1.45
V
V
CCD_AB_DPL,
V
CCD_HMPLL
Processor DPLL, & HMPLL
voltage with respect to V
voltage with respect to V
SS
-0.3
1.45
V
V
CCSFR_AB_DPL,
Processor SFR DPLL voltage
with respect to V
with respect to V
SS
-0.3
2.25
V
V
CCACRTDAC
Processor CRT DAC voltage
with respect to V
with respect to V
SS
-0.3
2.25
V