Sony HDCU3300 User Manual

Page of 52
50
Specifications
Design and specifications are subject to change without 
notice.
HKCU1005 (optional)
General
Power supply
5.3 W
Operating temperature
–10°C to +40°C (+14°F to +104°F)
Storage temperature
–20°C to +60°C (–4°F to +140°F)
Dimensions (w/h/d)
DRX board: Approx. 19 × 110 × 226 mm 
(3/4 × 4 3/8 × 8 7/8 inches)
HIF board: Approx. 19 × 98 × 159 mm 
(3/4 × 3 7/8 × 6 1/4 inches)
Mass
DRX board: Approx. 0.24 kg (8.5 oz)
HIF board: Approx. 0.09 kg (3.2 oz)
Output connectors
HIF board
SDI OUT
BNC-type (4)
HD-SDI: SMPTE-292M, 0.8 Vp-p, 
75 ohms, 1.485 Gbps/1.4835 Gbps
SD-SDI: SMPTE-259M, 0.8 Vp-p, 
75 ohms, 270 Mbps
HD-SDI/SD-SDI selectable
Character ON/OFF selectable (SDI 
OUT3 and SDI OUT4) 
Design and specifications are subject to change without 
notice.
Note
Always verify that the unit is operating properly before 
use. SONY WILL NOT BE LIABLE FOR DAMAGES 
OF ANY KIND INCLUDING, BUT NOT LIMITED 
TO, COMPENSATION OR REIMBURSEMENT ON 
ACCOUNT OF THE LOSS OF PRESENT OR 
PROSPECTIVE PROFITS DUE TO FAILURE OF 
THIS UNIT, EITHER DURING THE WARRANTY 
PERIOD OR AFTER EXPIRATION OF THE 
WARRANTY, OR FOR ANY OTHER REASON 
WHATSOEVER.