Intel i7-950 AT80601002112AA User Manual

Datasheet 

31

The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with 
the motherboard using an LGA1366 socket. The package consists of a processor 
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to 
the package substrate and core and serves as the mating surface for processor thermal 
solutions, such as a heatsink. 

 shows a sketch of the processor package 

components and how they are assembled together. Refer to the appropriate processor 
Thermal and Mechanical Design Guidelines (see 

) for complete details on 

the LGA1366 socket.

The package components shown in 

• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor core (die)
• Package substrate
• Capacitors

1.

Socket and motherboard are included for reference and are not part of the processor package.

The package mechanical drawings are shown in 

. The 

drawings include dimensions necessary to design a thermal solution for the processor. 
These dimensions include:

• Package reference with tolerances (total height, length, width, etc.)
• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keep-out dimensions
• Reference datums
• All drawing dimensions are in mm. 
• Guidelines on potential IHS flatness variation with socket load plate actuation and 

installation of the cooling solution is available in the appropriate processor Thermal 
and Mechanical Design Guidelines (see 

IHS

Substrate 

LGA1366 Socket

System Board 

Capacitors 

TIM

IHS

Substrate 

LGA 

System Board 

Capacitors 

Die

TIM