Intel X3360 AT80569KJ073N Data Sheet

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Datasheet

Commonly used terms are explained here for clarification:

• Quad-Core Intel® Xeon® Processor 3300 Series — Quad core processor in the 

FC-LGA6 package with two 6 MB L2 cache or two 3 B L2 cache. 

• Processor — For this document, the term processor is the generic form of the 

Quad-Core Intel® Xeon® Processor 3300 Series.

• Intel

 microarchitecture — A new foundation for Intel

®

 architecture-

based desktop, mobile and mainstream server multi-core processors. For additional 

information refer to: 

http://www.intel.com/technology/architecture/coremicro/

• Keep-out zone — The area on or near the processor that system design can not 

utilize. 

• Processor core — Processor die with integrated L2 cache. 
• LGA775 socket — The processor mates with the system board through a surface 

mount, 775-land, LGA socket.

• Integrated heat spreader (IHS) —A component of the processor package used 

to enhance the thermal performance of the package. Component thermal solutions 

interface with the processor at the IHS surface.

• Retention mechanism (RM) — Since the LGA775 socket does not include any 

mechanical features for heatsink attach, a retention mechanism is required. 

Component thermal solutions should attach to the processor via a retention 

mechanism that is independent of the socket.

• FSB (Front Side Bus) — The electrical interface that connects the processor to 

the chipset. Also referred to as the processor system bus or the system bus. All 

memory and I/O transactions as well as interrupt messages pass between the 

processor and chipset over the FSB.

• Storage conditions — Refers to a non-operational state. The processor may be 

installed in a platform, in a tray, or loose. Processors may be sealed in packaging or 

exposed to free air. Under these conditions, processor lands should not be 

connected to any supply voltages, have any I/Os biased, or receive any clocks. 

Upon exposure to “free air”(i.e., unsealed packaging or a device removed from 

packaging material) the processor must be handled in accordance with moisture 

sensitivity labeling (MSL) as indicated on the packaging material.

• Functional operation — Refers to normal operating conditions in which all 

processor specifications, including DC, AC, system bus, signal quality, mechanical 

and thermal are satisfied. 

• Execute Disable (XD) Bit — XD allows memory to be marked as executable or 

non-executable, when combined with a supporting operating system. If code 

attempts to run in non-executable memory the processor raises an error to the 

operating system. This feature can prevent some classes of viruses or worms that 

exploit buffer over run vulnerabilities and can thus help improve the overall security 

of the system. See the Intel® Architecture Software Developer's Manual for more 

detailed information.

• Intel

 64 Architecture — An enhancement to Intel's IA-32 architecture, allowing 

the processor to execute operating systems and applications written to take 

advantage of Intel 64 architecture. Further details on Intel 64 architecture and 

programming model can be found in the Software Developer Guide at http://

developer.intel.com/technology/64bitextensions/.

• Enhanced Intel SpeedStep

 Technology — Enhanced Intel SpeedStep 

Technology allows trade-offs to be made between performance and power 

consumptions, based on processor utilization. This may lower average power 

consumption (in conjunction with OS support).

• Intel

 VT) — A set of hardware 

enhancements to Intel server and client platforms that can improve virtualization 

solutions. Intel VT will provide a foundation for widely-deployed virtualization