Intel X3360 AT80569KJ073N Data Sheet

Datasheet

101

Refer to the Debug Port Design Guide for UP / DP Systems and the appropriate 

platform design guidelines for information regarding debug tools specifications. 

Intel is working with two logic analyzer vendors to provide logic analyzer interfaces 

(LAIs) for use in debugging Yorkfield processor systems. Tektronix and Agilent should 

be contacted to get specific information about their logic analyzer interfaces. The 

following information is general in nature. Specific information must be obtained from 

the logic analyzer vendor. 

Due to the complexity of Yorkfield processor systems, the LAI is critical in providing the 

ability to probe and capture FSB signals. There are two sets of considerations to keep in 

mind when designing a Yorkfield processor system that can make use of an LAI: 

mechanical and electrical.

The LAI is installed between the processor socket and the Yorkfield processor. The LAI 

lands plug into the processor socket, while the Yorkfield processor lands plug into a 

socket on the LAI. Cabling that is part of the LAI egresses the system to allow an 

electrical connection between the Yorkfield processor and a logic analyzer. The 

maximum volume occupied by the LAI, known as the keepout volume, as well as the 

cable egress restrictions, should be obtained from the logic analyzer vendor. System 

designers must make sure that the keepout volume remains unobstructed inside the 

system. Note that it is possible that the keepout volume reserved for the LAI may differ 

from the space normally occupied by the Yorkfield processors heatsink. If this is the 

case, the logic analyzer vendor will provide a cooling solution as part of the LAI.

The LAI will also affect the electrical performance of the FSB; therefore, it is critical to 

obtain electrical load models from each of the logic analyzers to be able to run system 

level simulations to prove that their tool will work in the system. Contact the logic 

analyzer vendor for electrical specifications and load models for the LAI solution it 

provides.

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