Intel X3360 AT80569KJ073N Data Sheet

Product codes

AT80569KJ073N

Datasheet

3-6

Processor Land Coordinates and Quadrants, Top View............................................... 40

4-1

land-out Diagram (Top View – Left Side)................................................................. 42

4-2

land-out Diagram (Top View – Right Side)............................................................... 43

5-1

Quad-Core Intel

® Xeon® Processor 3300 Series

Thermal Profile(95W) ................................ 78

5-2

Quad-Core Intel

Xeon

Processor 3300 Series Thermal Profile (65W) ....................... 79

5-3

Case Temperature (TC) Measurement Location ........................................................ 80

5-4

Thermal Monitor 2 Frequency and Voltage Ordering.................................................. 82

5-5

Conceptual Fan Control Diagram on PECI-Based Platforms ........................................ 84

6-1

Processor Low Power State Machine ....................................................................... 88

7-1

Mechanical Representation of the Boxed Processor ................................................... 91

7-2

Side View Space Requirements for the Boxed Processor ............................................ 92

7-3

Top View Space Requirements for the Boxed Processor ............................................. 93

7-4

Overall View Space Requirements for the Boxed Processor ........................................ 93

7-5

Boxed Processor Fan Heatsink Power Cable Connector Description.............................. 95

7-6

Baseboard Power Header Placement Relative to Processor Socket............................... 96

7-7

Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ............... 97

7-8

Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ............... 98

7-9

Boxed Processor Fan Heatsink Set Points ................................................................ 99

Tables

1-1

References.......................................................................................................... 11

2-1

Voltage Identification Definition ............................................................................. 14

2-2

Absolute Maximum and Minimum Ratings................................................................ 17

2-3

Voltage and Current Specifications ......................................................................... 18

2-4

Static and Transient Tolerance......................................................................... 19

2-5

Overshoot Specifications................................................................................. 21

2-6

FSB Signal Groups ............................................................................................... 23

2-7

Signal Characteristics ........................................................................................... 24

2-8

Signal Reference Voltages..................................................................................... 24

2-9

GTL+ Signal Group DC Specifications ..................................................................... 24

2-10

Open Drain and TAP Output Signal Group DC Specifications....................................... 25

2-11

CMOS Signal Group DC Specifications..................................................................... 25

2-12

PECI DC Electrical Limits....................................................................................... 26

2-13

GTL+ Bus Voltage Definitions ................................................................................ 27

2-14

Core Frequency to FSB Multiplier Configuration ........................................................ 28

2-15

BSEL[2:0] Frequency Table for BCLK[1:0]............................................................... 29

2-16

Front Side Bus Differential BCLK Specifications ........................................................ 30

2-17

FSB Differential Clock Specifications (1333 MHz FSB) ............................................... 30

3-1

Processor Loading Specifications ............................................................................ 38

3-2

Package Handling Guidelines ................................................................................. 38

3-3

Processor Materials .............................................................................................. 39

4-1

Alphabetical Land Assignments .............................................................................. 44

4-2

Numerical Land Assignment .................................................................................. 54

4-3

Signal Description................................................................................................ 64

5-1

Processor Thermal Specifications ........................................................................... 76

5-2

Quad-Core Intel

® Xeon® Processor 3300 Series

Thermal Profile (95W) ............................... 77

5-3

Quad-Core Intel

® Xeon® Processor 3300 Series

Thermal Profile (65W) ............................... 79

5-4

GetTemp0() Error Codes....................................................................................... 85

6-1

Power-On Configuration Option Signals................................................................... 87

7-1

Fan Heatsink Power and Signal Specifications .......................................................... 95

7-2

Fan Heatsink Power and Signal Specifications .......................................................... 99