Intel L3426 BV80605004737AA Data Sheet

Product codes
BV80605004737AA
Page of 102
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
11
Introduction
1
Introduction
The Dual-Core Intel
®
 Xeon
®
 processor 3000 series combines the performance of 
previous generation products with the power efficiencies of a low-power 
microarchitecture to enable smaller, quieter systems. These processors are 64-bit 
processors that maintain compatibility with IA-32 software.
The Dual-Core Intel
®
 Xeon
®
 processor 3000 series uses Flip-Chip Land Grid Array 
(FC-LGA6) package technology, and plugs into a 775-land surface mount, Land Grid 
Array (LGA) socket, referred to as the LGA775 socket. 
Note:
In this document unless otherwise specified, the Dual-Core Intel Xeon processor 3000 
series refers to Dual-Core Intel Xeon processors 3085, 3075, 3070, 3065, 3060, 3050, 
and 3040. Unless otherwise specified the Dual-Core Intel Xeon processor 3000 series is 
referred to as “processor.”
The processors support several Advanced Technologies including the Execute Disable 
Bit, Intel
®
 64, and Enhanced Intel SpeedStep
®
 Technology. In addition, the Dual-Core 
Intel
®
 Xeon
®
 processor 3000 series supports Intel
®
 Virtualization Technology 
(Intel
®
VT) and Intel
®
 Trusted Execution Technology (Intel
®
 TXT).
The processor's front side bus (FSB) uses a split-transaction, deferred reply protocol 
like the Intel
®
 Pentium
®
 4 processor. The FSB uses Source-Synchronous Transfer (SST) 
of address and data to improve performance by transferring data four times per bus 
clock (4X data transfer rate, as in AGP 4X). Along with the 4X data bus, the address 
bus can deliver addresses two times per bus clock and is referred to as a "double-
clocked" or 2X address bus. Working together, the 4X data bus and 2X address bus 
provide a data bus bandwidth of up to 
8.5 
10.7 GB/s.
Intel has enabled support components for the processor including heatsink, heatsink 
retention mechanism, and socket. Manufacturability is a high priority; hence, 
mechanical assembly may be completed from the top of the baseboard and should not 
require any special tooling.
The processor includes an address bus power-down capability which removes power 
from the address and data signals when the FSB is not in use. This feature is always 
enabled on the processor.
1.1
Terminology
A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in 
the active state when driven to a low level. For example, when RESET# is low, a reset 
has been requested. Conversely, when NMI is high, a nonmaskable interrupt has 
occurred. In the case of signals where the name does not imply an active state but 
describes part of a binary series (such as address or data), the ‘#’ symbol implies that 
the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and D[3:0]# = 
‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
The phrase “Front Side Bus” refers to the interface between the processor and system 
core logic (a.k.a. the chipset components). The FSB is a multiprocessing interface to 
processors, memory, and I/O.