Intel L3426 BV80605004737AA Data Sheet
Product codes
BV80605004737AA
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
99
Boxed Processor Specifications
7.3
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the
boxed processor.
boxed processor.
7.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is listed in
processor's temperature specification is also a function of the thermal design of the
entire system, and ultimately the responsibility of the system integrator. The processor
temperature specification is listed in
. The boxed processor fan heatsink is
able to keep the processor temperature within the specifications (see
chassis that provide good thermal management. For the boxed processor fan heatsink
to operate properly, it is critical that the airflow provided to the fan heatsink is
unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan
heatsink. Airspace is required around the fan to ensure that the airflow through the fan
heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling
efficiency and decreases fan life.
to operate properly, it is critical that the airflow provided to the fan heatsink is
unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan
heatsink. Airspace is required around the fan to ensure that the airflow through the fan
heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling
efficiency and decreases fan life.
illustrate an acceptable
airspace clearance for the fan heatsink. The air temperature entering the fan should be
kept below 38 ºC. Again, meeting the processor's temperature specification is the
responsibility of the system integrator.
kept below 38 ºC. Again, meeting the processor's temperature specification is the
responsibility of the system integrator.
Figure 7-6. Baseboard Power Header Placement Relative to Processor Socket
Boxed Proc PwrHeaderPlacement
B
C
R110
[4.33]