Intel L3426 BV80605004737AA Data Sheet

Product codes
BV80605004737AA
Page of 102
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
99
Boxed Processor Specifications
7.3
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the 
boxed processor.
7.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the 
processor's temperature specification is also a function of the thermal design of the 
entire system, and ultimately the responsibility of the system integrator. The processor 
temperature specification is listed in 
. The boxed processor fan heatsink is 
able to keep the processor temperature within the specifications (see 
chassis that provide good thermal management. For the boxed processor fan heatsink 
to operate properly, it is critical that the airflow provided to the fan heatsink is 
unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan 
heatsink. Airspace is required around the fan to ensure that the airflow through the fan 
heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling 
efficiency and decreases fan life. 
 illustrate an acceptable 
airspace clearance for the fan heatsink. The air temperature entering the fan should be 
kept below 38 ºC. Again, meeting the processor's temperature specification is the 
responsibility of the system integrator. 
Figure 7-6. Baseboard Power Header Placement Relative to Processor Socket
Boxed Proc PwrHeaderPlacement
B
C
R110
[4.33]