Intel 2 Duo T6500 AW80577GG0452ML User Manual

Product codes
AW80577GG0452ML
Page of 113
Datasheet
49
Electrical Specifications
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
The V
CCP
 referred to in these specifications refers to instantaneous V
CCP
.
3.
Measured at 0.1 *V
CCP
4.
Measured at 0.9 *V
CCP
5.
For Vin between 0 V and V
CCP
. Measured when the driver is tristated.
6.
Cpad1 includes die capacitance only for DPRSTP#, DPSLP#, PWRGOOD. No package parasitics are 
included.
7.
Cpad2 includes die capacitance for all other CMOS input signals. No package parasitics are included.
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
Measured at 0.2 V.
3.
V
OH
 is determined by value of the external pull-up resistor to V
CCP
4.
For Vin between 0 V and V
OH
.
5.
Cpad includes die capacitance only. No package parasitics are included.
§ 
Table 14.
CMOS Signal Group DC Specifications
Symbol
Parameter
Min
Typ
Max
Unit
Notes
1
V
CCP
I/O Voltage
1.00
1.05
1.10
V
V
IL
Input Low Voltage CMOS
-0.10
0.00
0.3*V
CCP
V
2
V
IH
Input High Voltage
0.7*V
CCP
V
CCP
V
CCP
+0.1
V
2
V
OL
Output Low Voltage
-0.10
0
0.1*V
CCP
V
2
V
OH
Output High Voltage
0.9*V
CCP
V
CCP
V
CCP
+0.1
V
2
I
OL
Output Low Current
1.5
4.1
mA
3
I
OH
Output High Current
1.5
4.1
mA
4
I
LI
Input Leakage Current
±100
µA
5
Cpad1
Pad Capacitance
1.80
2.30
2.75
pF
6
Cpad2
Pad Capacitance for CMOS Input
0.95
1.2
1.45
pF
7
Table 15.
Open Drain Signal Group DC Specifications
Symbol
Parameter
Min
Typ
Max
Unit
Notes
1
V
OH
Output High Voltage
V
CCP
–5%
V
CCP
V
CCP
+5%
V
3
V
OL
Output Low Voltage
0
0.20
V
I
OL
Output Low Current
16
50
mA
2
I
LO
Output Leakage Current
±200
µA
4
Cpad
Pad Capacitance
1.80
2.30
2.75
pF
5