Sony XR-CA600V User Manual

2

Location of Controls .......................................................

3

Setting the Clock .............................................................

4

2-1. Disassembly Flow ...........................................................

8

2-2. Mechanism Deck (MG-25G-136) ...................................

8

2-3. MAIN Board ...................................................................

9

2-4. Heat Sink (ISO2P) ..........................................................

9

3-1. Housing ........................................................................... 10
3-2. Arm (Suction) ................................................................. 10
3-3. Lever (LDG-A)/(LDG-B) ............................................... 11
3-4. Gear (LDG-FT) ............................................................... 11
3-5. Guide (C) ......................................................................... 12
3-6. Mounting Position of Capstan/Reel Motor (M901) ....... 12

....................... 13

Tape Deck Section .......................................................... 13
Tuner Section .................................................................. 13

6-1. Note for Printed Wiring Boards and

Schematic Diagrams ....................................................... 14

6-2. Printed Wiring Board – MAIN Board – ......................... 15
6-3. Schematic Diagram – MAIN Board (1/3) – ................... 16
6-4. Schematic Diagram – MAIN Board (2/3) – ................... 17
6-5. Schematic Diagram – MAIN Board (3/3) – ................... 18
6-6. Printed Wiring Board – SUB Board – ............................ 19
6-7. Schematic Diagram – SUB Board – ............................... 19
6-8. Printed Wiring Board

– KEY Board (XR-CA600/CA600X) – ......................... 20

6-9. Printed Wiring Board

– KEY Board (XR-CA600V) – ...................................... 21

6-10. Schematic Diagram – KEY Board – .............................. 22
6-11. IC Pin Function Description ........................................... 26

7-1. General Section ............................................................... 29
7-2. Front Panel Section ......................................................... 30
7-3. Mechanism Deck Section (MG-25G-136) ..................... 31

............................... 32

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.