Intel X3480 BV80605002505AH Data Sheet
Product codes
BV80605002505AH
Thermal Specifications and Design Considerations
76
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to
. In all cases the Thermal Monitor and
Thermal Monitor 2 feature must be enabled for the processor to remain within
specification.
specification.
Table 5-1.
Processor Thermal Specifications
Processor
Number
Core
Frequency
(GHz)
Thermal
Design
Power (W)
Extended
HALT
Power (w)
1
Notes:
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power
that the processor can dissipate.
775_VR_
CONFIG_06
Guidance
2
2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the
maximum T
C
will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for
the allowed combinations of power and T
C
.
3Refer to the “Component Identification Information” section of the Dual-Core Intel
®
Xeon
®
Processor 3000 Series Specification
Update for processor specific Idle power.
4.775_VR_CONFIG_06/775_VR_CONFIG_05B guidelines provide a design target for meeting future thermal requirements.
5.
Specification is at 35 °C T
C
and typical voltage loadline.
6. Specification is at 50 °C T
C
and typical voltage loadline.
Specification is ensured by design characterization and not 100% tested
.
Minimum T
C
(°C)
Maximum T
C
(°C)
Notes
3085
3.00
65.0
8.0
775_VR_CONFIG_0
6
5
See
,
5
3075
2.66
65.0
8.0
5
5
3065
2.33
65.0
8.0
5
5
3070
2.66
65.0
22.0
775_VR_CONFIG_0
6
5
See
,
and
6
3060
2.40
65.0
22.0
5
6
3050
2.13
65.0
22.0
775_VR_CONFIG_0
6
5
See
,
and
6
3040
1.86
65.0
22.0
5
6