Intel N475 AU80610006240AA User Manual

Product codes
AU80610006240AA
Page of 85
Functional Description
26
Datasheet
3.1.3
Rules for populating SO-DIMM slots
The frequency of system memory will be the lowest frequency of all SO-DIMMs in the 
system, as determined through the SPD registers on the SO-DIMMs. Timing 
parameters [CAS latency (or CL + AL for DDR2), tRAS, tRCD, tRP] must be 
programmed to match within a channel.
To take advantage of enhanced addressing, it should be populating both SO-DIMM slots 
with the identical Raw Card type. If one SO-DIMM is used only, it should be populating 
the second slot (the further slot to the processor’s Integrated Memory Controller) to 
get the best signal quality.
3.1.4
Intel
®
 Fast Memory Access (Intel
®
 FMA) Technology 
Enhancements
The following sections outline and explain the technology enhancements: Just-in-Time 
Command Scheduling, Command Overlap, Out-of-Order Scheduling and Opportunistic 
Writes.
3.1.4.1
Just-in-Time Command Scheduling
The memory controller has an advanced command scheduler where all pending 
requests are examined simultaneously to determine the most efficient request to be 
issued next. The most efficient request is picked from all pending requests and issued 
to system memory Just-in-Time to make optimal use of Command Overlapping. Thus, 
instead of having all memory access requests go individually through an arbitration 
mechanism forcing requests to be executed one at a time, they can be started without 
interfering with the current request allowing for concurrent issuing of requests. This 
allows for optimized bandwidth and reduced latency while maintaining appropriate 
command spacing to meet system memory protocol.
3.1.4.2
Command Overlap
Command Overlap allows the insertion of the DRAM commands between the Activate, 
Precharge, and Read/Write commands normally used, as long as the inserted 
commands do not affect the currently executing command. Multiple commands can be 
issued in an overlapping manner, increasing the efficiency of system memory protocol.
C
256MB
512Mb
32M x 16
4
1
8K
C
512MB
1Gb
64M x 16
4
1
8K
C
1GB
2Gb
128M x 16
4
1
8K
Table 3-16.Supported SO-DIMM Module Configurations  (Sheet 2 of 2)
Raw Card 
Tpye
DIMM 
Capacity
DRAM 
Device 
Tech.
DRAM 
Organization
# of DRAM 
Devices
# of 
Ranks
Page 
Size