Sony GDM-F500T9 User Manual

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Note: Hand degauss must be used on stand-by or power-off condition.

This model has an automatic earth magnetism correction function by using an earth

magnetism sensor and a LCC coil. When using a hand degauss while monitor (LCC

coil) is being operated, it sometimes gets magnetized, and the system may not work

properly as a result.

................................................................. 1-1

2-1.

Cabinet Removal ............................................... 2-1

2-2.

D Board Removal .............................................. 2-1

2-3.

G Board Removal .............................................. 2-2

2-4.

A Board Removal .............................................. 2-2

2-5.

L Board Removal .............................................. 2-3

2-6.

Service Position .................................................. 2-3

2-7.

H1, H2 and J Boards Removal .......................... 2-4

2-8.

US Board Removal ............................................. 2-4

2-9.

Picture Tube Removal ....................................... 2-5

2-10. Harness Location ................................................ 2-6

............. 3-1

..................................................... 4-1

5-1.

Block Diagrams .................................................. 5-1

5-2.

Frame Shcematic Diagram ................................. 5-7

5-3.

Circuit Boards Location ..................................... 5-9

5-4.

Schematic Diagrams and Printed Wiring

Boards ................................................................. 5-9

(1)

Schematic Diagrams of D (1/2, 2/2) Board ...... 5-13

(2)

Schematic Diagrams of G, H1, H2, J and

L Boards ............................................................ 5-17

(3)

Schematic Diagram of A Board ........................ 5-24

(4)

Schematic Diagram of US Board (-11)

(OLD) ................................................................ 5-29

(5)

Schematic Diagram of US Board (-12, -13)

(NEW) .............................................................. 5-33

5-5.

Semiconductors ................................................. 5-35

6-1.

Chassis ............................................................... 6-1

6-2.

Picture Tube ...................................................... 6-2

6-3.

Packing Materials .............................................. 6-3

............................ 7-1