Intel 200 User Manual

Thermal and Mechanical Design Guidelines 

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Figure 9.  Case Study #4: A “Top Mount Fan” PSU is located next to Processor in μATX 

 

In summary, heatsink design considerations for the Intel Celeron processor 200 

sequence on the Intel Desktop Board D201GLY2 include:  

•  The heatsink temperature 

TS-TOP-MAX

 which is a function of system thermal 

performance must be compliant in order to ensure processor reliability. 

•  Heatsink interface to die surface characteristics, including flatness and roughness. 

•  The performance of the thermal interface material used between the heatsink and 

the die.  

•  The required heatsink clip static load, 9.9 lbf ± 1.2 lbf, throughout the life of the 

product (refer to Section 2.1.2.2 for further information). 

•  Surface area of the heatsink. 

•  Heatsink material and technology. 

•  Volume of airflow over the heatsink surface area. 

•  Development of airflow entering and within the heatsink area. 

•  Physical volumetric constraints placed by the system. 

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