Intel 200 User Manual

8  

 

Thermal and Mechanical Design Guidelines 

This design guide supports the following processors: 

•  Intel

®

 Celeron

®

 Processor 200 sequence applies to the Intel

®

 Celeron

®

 processor 

220. 

In this document the Intel Celeron Processor 200 sequence will be referred to as “the 

processor”.  

In this document when a reference is made to “the processor” it is intended that this 

includes all the processors supported by this document.  If needed for clarity, the 

specific processor will be listed.  

In this document, when a reference is made to “datasheet”, the reader should refer to 

the Intel

 Processor 200 Sequence Datasheet.  If needed for clarity, the 

specific processor datasheet will be referenced.  

In this document, when a reference is made to the “the reference design” it is 

intended that this includes all reference designs (D16869-001 and D96271-001) 

supported by this document.  If needed for clarify, the specific reference design will be 

listed.   

Chapter 2 of this document discusses package thermal mechanical requirements to 

design a thermal solution for the Intel Celeron processor 200 sequence in the context 

of personal computer applications. Chapter 3 discusses the thermal solution 

considerations and metrology recommendations to validate a processor thermal 

solution.  Chapter 4 gives information on the Intel reference thermal solution for the 

processor in a system application.    

The physical dimensions and thermal specifications of the processor that are used in 

this document are for illustration only.  Refer to the Datasheet for the product 

dimensions, thermal power dissipation, and maximum junction temperature.  In case 

of conflict, the data in the datasheet supersedes any data in this document.