Motorola PRPMC800A/IH5 User Manual

Board component temperatures are affected by ambient temperature, air flow, board electrical 
operation, and software operation. In order to evaluate the thermal performance of a circuit 
board assembly, it is necessary to test the board under actual operating conditions. These 
operating conditions vary depending on system design.

While Motorola performs thermal analysis in a representative system to verify operation within 
specified ranges (see 

), you should evaluate the thermal performance of 

the board in your application.

This appendix provides systems integrators with information which can be used to conduct 
thermal evaluations of the board in their specific system configuration. It identifies thermally 
significant components and lists the corresponding maximum allowable component operating 
temperatures. It also provides example procedures for component-level temperature 
measurements.

 summarizes components that exhibit significant temperature rises. These 

are the components that should be monitored in order to assess thermal performance. The 
table also supplies the component reference designator and the maximum allowable operating 
temperature.

You can find components on the board by their reference designators as shown in 

 

and 

. Versions of the board that are not fully populated may not contain some of these 

components.