Fujitsu FR81S User Manual

CHAPTER 1: OVERVIEW

8. Device Package

FUJITSU SEMICONDUCTOR LIMITED

CHAPTER : OVERVIEW

FUJITSU SEMICONDUCTOR CONFIDENTIAL

Figure 8-7 LQFP-176(FPT-176P-M07) External Dimensions

176-pin plastic LQFP

Lead pitch

0.50 mm

Package width ×

package length

24.0 × 24.0 mm

Lead shape

Gullwing

Sealing method

Plastic mold

Mounting height

1.70 mm MAX

Code

(Reference)

P-LQFP-0176-2424-0.50

176-pin plastic LQFP

(FPT-176P-M07)

2004-2010 FUJITSU SEMICONDUCTOR LIMITED F176013S-c-1-3

Details of "A" part

0°~8°

0.50±0.20

(.020±.008)

0.60±0.15

(.024±.006)

0.25(.010)

(Stand off)

(.004±.004)

0.10±0.10

1.50

+0.20

–0.10
+.008

–.004

.059

(Mounting height)

0.08(.003)

(.006±.002)

0.145±0.055

"A"

INDEX

LEAD No.

132

133

176

0.50(.020)

0.22±0.05

(.009±.002)

0.08(.003)

*24.00±0.10(.945±.004)SQ

26.00±0.20(1.024±.008)SQ

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) * : Values do not include resin protrusion.

Resin protrusion is +0.25(.010)Max(each side).

Note 2) Pins width and pins thickness include plating thickness

Note 3) Pins width do not include tie bar cutting remainder.

Please confirm the latest Package dimension by following URL.

http://edevice.fujitsu.com/package/en-search/

MB91520 Series

MN705-00010-1v0-E