Epson S1C33L03 User Manual
9 PACKAGE
S1C33L03 PRODUCT PART
EPSON
A-109
A-1
A-9
9 Package
9.1
Plastic Package
QFP20-144pin
(Unit: mm)
20
±
0.1
22
±
0.4
73
108
20
±
0.1
22
±
0.4
37
72
INDEX
0.2
36
1
144
109
1.4
±
0.1
0.1
1.7
max
1
0.5
±
0.2
0
°
10
°
0.125
0.5
+0.1
–0.05
+0.05
–0.025
Limit of power consumption
The chip temperature of an LSI rises according to power consumption. The chip temperature can be
calculated from environment temperature (Ta), thermal package resistance (
θ
) and power consumption (P
D
).
Chip temperature (Tj) = Ta + (P
D
×
θ
) (°C)
As a guide, normally keep the chip temperature (Tj) lower than 85°C.
The thermal resistance of the QFP20-144pin package is as follows:
Thermal resistance (°C/W) = 110 to 120°C (90 to 100°C for Cu lead frame)
This thermal resistance is a value under the condition that the measured device is hanging in the air and has
no air-cooling. Thermal resistance greatly varies according to the mounting condition on the board and air-
cooling condition.