HP (Hewlett-Packard) 8470p User Manual
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink
and the system board components each time the heat sink is removed. Replacement thermal
material is included with the heat sink, processor, and system board spare part kits.
material is included with the heat sink, processor, and system board spare part kits.
The following illustration shows the replacement thermal material locations on a computer model
equipped with a graphics subsystem with discrete memory.
equipped with a graphics subsystem with discrete memory.
●
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that
services it
services it
The following illustration shows the replacement thermal material locations on a computer model
equipped with a graphics subsystem with UMA memory. Thermal paste is used on the
processor (1) and the heat sink section (2) that services it.
equipped with a graphics subsystem with UMA memory. Thermal paste is used on the
processor (1) and the heat sink section (2) that services it.
112 Chapter 4 Removal and replacement procedures