Focus Enhancements FS456 Data Sheet
FS453/4 AND FS455/6
DATA SHEET: HARDWARE REFERENCE
9.6 Solder Re-flow Profiles
The following figures provide solder re-flow profiles for the PQFP and FBGA packages with lead and
lead-free solder options.
lead-free solder options.
6°C/sec max.
Max. 235 +5, -0 °C
10sec +/-3sec
20~60sec
(Over 200°C)
3°C/sec Max.
140~160°C
60~120sec
3°C/sec Max.
Max. 240°C
Cooling down(F)
Re-flow peak(E)
Maintain(D)
Heat-up(C)
Pre-heat(B)
Heat-up(A)
Peak Temp.
IR Re-flow Profile for Pre-conditioning
100
200
300
°C
B
C
D
E (Peak Temperature 235°C +5, -0 °C)
A
F
sec
IR Re
IR Re
-
-
flow Profile
flow Profile
Figure 15 PQFP Package (Lead Solder)
JANUARY, 2005, VERSION 3.0
38
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©2003-4 FOCUS ENHANCEMENTS, INC.
FOCUS Enhancements Semiconductor