Fujitsu FTR-G1 User Manual

5

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 Relays produced after the specific date code that is indicated on each data sheet are lead-free

 now. All of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.

 (http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)

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 Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu.

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 All signal and power relays also comply with RoHS. Please refer to individual data

 sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials that

 are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE).

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 It has been verified that using lead-free relays in leaded assembly process will not cause any

 problems (compatible).

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 “LF” is marked on each outer and inner carton. (No marking on individual relays).

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 To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.

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We will ship leaded relays as long as the leaded relay inventory exists.

Note: Cadmium was exempted from RoHS on October 21, 2005. (Amendment to Directive 2002/95/EC)

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Recommended solder paste Sn-3.0Ag-0.5Cu.

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Moisture Sensitivity Level standard is not applicable to electromechanical realys.

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Dipped SnAgCu solder is known as low risk tin whisker. No considerable length whisker was found by our in

 house test.

Pre-heating:

maximum 120˚C

Soldering:

dip within 5 sec. at

260˚C soler bath

Soldering Iron

Temperature:  maximum 360˚C

Duration:

maximum 3 sec.