Lenovo Pentium III 25P2836 Leaflet

Product codes
25P2836
Page of 2
Pentium
®
III Processors for 
Applied Computing
product brief
Pentium
®
III Processor Product Highlights
Available in 600, 700 and 850 MHz for a 
100 MHz processor side bus
Available in 733, 866 MHz, and 1 GHz for a
133 MHz processor side bus
Validated with Intel
®
840, 815, 815E, 810 and
440BX Chipsets
Available in 1.26 GHz for a 133 MHz
processor side bus
Validated with Intel
®
815E Chipset and
Chipsets from third-party-vendors
Manufactured on state-of-the-art .13µ process
technology
512 KB Advanced transfer cache-on-die, 
full-speed Level 2 (L2) cache with Error
Correcting Code (ECC) 
16 KB instruction, 16 KB data non-blocking, 
Level 1 (L1) cache
P6 Dynamic execution microarchitecture
including multiple branch prediction, data
flow analysis and speculative execution
Streaming SIMD extensions, consisting of 
70 new instructions that enable advanced
imaging, 3D, streaming audio and video, and
speech recognition
Intel
®
MMX
media enhancement technology
Dual Independent Bus (DIB) architecture:
separate dedicated external processor side bus
and dedicated internal high-speed cache bus
Memory is cacheable for 64 Gbytes of
addressable memory space 
Both dual-processor (with third-party chipsets)
and uni-processor capable
Data integrity and reliability features such as
Error Correcting Code, Fault Analysis and
Recovery for both system and L2 cache buses
Fully compatible with existing Intel
®
Architecture-based software
Flip-Chip Pin Grid Array 2 (same as for 
FC-PGA with an Integrated Heat Spreader)
Embedded life cycle support
Pentium
®
III Processor with 512K Cache
Product Highlights
Manufactured on .18µ process technology
256 KB Advanced transfer cache-on-die, 
full-speed Level 2 (L2) cache with Error
Correcting Code (ECC) 
16 KB instruction, 16 KB data non-blocking, 
Level 1 (L1) cache
P6 Dynamic execution microarchitecture
including multiple branch prediction, data
flow analysis and speculative execution
Streaming SIMD extensions, consisting of 
70 new instructions that enable advanced
imaging, 3D, streaming audio and video, and
speech recognition
Intel MMX
media enhancement technology
Dual Independent Bus (DIB) architecture:
separate dedicated external processor side bus
and dedicated internal high-speed cache bus
Memory is cacheable for 64 Gbytes of
addressable memory space 
Both dual-processor (with the 840 Chipset
only) and uni-processor capable
Data integrity and reliability features such as
Error Correcting Code, Fault Analysis and
Recovery for both system and L2 cache buses
Fully compatible with existing Intel
®
Architecture-based software
Flip-Chip Pin Grid Array (PGA370)
packaging
Embedded life cycle support