Supermicro Xeon P4X-024-512K User Manual

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The boxed processor ships with an active duct cooling solution called the Processor Wind Tunnel,
or PWT. This is an optional cooling solution that is designed to meet the thermal requirements of a
diverse combination of baseboards and chassis. It ships with the processor in order to reduce the
burden on the chassis manufacture to provide adequate airflow across the processor heatsink.
Manufacturers may elect to use their own cooling solution.

Although Intel will be testing a select number of baseboard and chassis combinations for thermal
compliance, this is in no way a comprehensive test. It is ultimately the system integrator’s
responsibility to test that their solution meets all of the requirements specified in this document.
The PWT is meant to assist in processor cooling, but additional cooling techniques may be required
in order to ensure that the entire system meets the thermal requirements.

See 

 and 

 for the Processor Wind Tunnel dimensions.

The Processor Wind Tunnel includes a 25mm fan for use with processors <= 2.8 GHz, or a 38mm 
fan for use with processors running at 3 GHz. The 38mm fan provides the high performance 
required to meet the demanding thermal requirements of processors running at 3 GHz. The 38mm 
fan provides local fan speed control. There is a temperature diode on the fan that measures the inlet 
temperature to the fan and adjusts the speed accordingly. The benefit is that system manufacturers 
can pass acoustical requirements while still being able to pass thermal requirements at maximum 
ambient temperature

The Processor Wind Tunnel includes a fan, which requires a constant +12V power supply. A fan
power cable is shipped with the boxed processor to draw power from a power header on the
baseboard. The power cable connector and pinouts are shown in 

 and the fan cable

connector requirements are detailed in 

. Platforms must provide a matched power header

to support the boxed processor. 

 contains specifications for the input and output signals at

the fan heatsink connector. The fan heatsink outputs a SENSE signal, an open-collector output, that
pulses at a rate of two pulses per fan revolution. A baseboard pull-up resistor provides V

OH

 to

match the baseboard-mounted fan speed monitor requirements, if applicable. Use of the SENSE
signal is optional. If the SENSE signal is not used, pin 3 of the connector should be tied to GND.

The power header on the baseboard must be positioned to allow the fan heatsink power cable to
reach it. The power header identification and location should be documented in the platform
documentation, or on the baseboard itself. The baseboard power header should be positioned
within 7 inches from the centre of the processor socket