Fujifilm Xeon 5110 S26361-F3243-L160 Data Sheet
Product codes
S26361-F3243-L160
Dual-Core Intel
®
Xeon
®
Processor 5100 Series Datasheet
75
Thermal Specifications
The upper point of the thermal profile consists of the Thermal Design Power (TDP)
defined in
defined in
CASE
value. It should be noted that the upper
point associated with Thermal Profile B (x = TDP and y = T
CASE_MAX
B @ TDP)
represents a thermal solution design point. In actuality the processor case temperature
will not reach this value due to TCC activation (see
will not reach this value due to TCC activation (see
). The lower point of the
thermal profile consists of x = P
_PROFILE_MIN
and y = T
CASE_MAX
@ P
_PROFILE_MIN
.
P
_PROFILE_MIN
is defined as the processor power at which T
CASE
, calculated from the
thermal profile, is equal to 50°C.
Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
instead of the maximum processor power consumption. The Thermal Monitor
feature is intended to help protect the processor in the event that an application
exceeds the TDP recommendation for a sustained time period. For more details on this
feature, refer to
exceeds the TDP recommendation for a sustained time period. For more details on this
feature, refer to
. To ensure maximum flexibility for future requirements,
systems should be designed to the Flexible Motherboard (FMB) guidelines, even if a
processor with lower power dissipation is currently planned. The Thermal Monitor
and Enhanced Thermal Monitor features must both be enabled in BIOS for the
processor to be operating within specifications.
processor with lower power dissipation is currently planned. The Thermal Monitor
and Enhanced Thermal Monitor features must both be enabled in BIOS for the
processor to be operating within specifications.
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in
.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
4.
Power specifications are defined at all VIDs found in
.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirement.
6.
This applies to the Dual-Core Intel® Xeon® Processor 5160 beginning with the G-step. The B-step
specifications can be found in
Table 6-1.
Dual-Core Intel® Xeon® Processor 5100 Series Thermal Specifications
Core
Frequency
Maximum
Power
(W)
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
5110 through
5150
80
65
5
1, 2, 3, 4, 5, 6
5160
80
65
5
1, 2, 3, 4, 5, 6,
7