Intel Pentium Mobile T2130 LF80539GE0361M Data Sheet

Datasheet

3

Introduction ..............................................................................................................7
1.1

Terminology .......................................................................................................7

Low Power Features ..................................................................................................9
2.1

Clock Control and Low Power States ......................................................................9
2.1.1

Core Low-Power States ........................................................................... 11

Enhanced Intel SpeedStep® Technology .............................................................. 13

Electrical Specifications ........................................................................................... 17
3.1

Power and Ground Pins ...................................................................................... 17

FSB Clock (BCLK[1:0]) and Processor Clocking...................................................... 17

Voltage Identification ......................................................................................... 17

Signal Terminations and Unused Pins ................................................................... 21

FSB Signal Groups............................................................................................. 21

CMOS Signals ................................................................................................... 23

Maximum Ratings.............................................................................................. 23

3.10 Processor DC Specifications ................................................................................ 24

Package Mechanical Specifications and Pin Information .......................................... 29
4.1

Package Mechanical Specifications ....................................................................... 29

Alphabetical Signals Reference ............................................................................ 55

Thermal Specifications and Design Considerations .................................................. 63
5.1

Monitoring Processor Temperature....................................................................... 64
5.1.1

Thermal Diode ....................................................................................... 64

Package-Level Low Power States................................................................................ 10

Core Low Power States ............................................................................................. 10