Intel E8200 BX80570E8200A User Manual

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Thermal and Mechanical Design Guidelines  

Structural design strategy for the reference design is to minimize upward board 

deflection during shock to help protect the LGA775 socket. 

The reference design uses a high clip stiffness that resists local board curvature under 
the heatsink, and minimizes, in particular, upward board deflection (Figure 

6-5). In 

addition, a moderate preload provides initial downward deflection.  

 

 

The target metal clip nominal stiffness is 540 N/mm [3100 lb/in]. The combined target 

for reference clip and fasteners nominal stiffness is 380 N/mm [2180 lb/in]. The 

nominal preload provided by the reference design is 191.3 N ± 44.5 N [43 lb ± 10 lb]. 

Note:  Intel reserves the right to make changes and modifications to the design as necessary 

to the reference design, in particular the clip and fastener.