Intel Pentium M 770 RH80536GE0462M Data Sheet

Datasheet

63

The processor requires a thermal solution to maintain temperatures within operating 

limits. 

For optimal operation and long-term reliability of Intel processor-based systems, the 

system/processor thermal solution should be designed so that the processor remains 

within the minimum and maximum junction temperature (Tj) specifications at the 

corresponding thermal design power (TDP) value listed in 

. 

Any attempt to operate that processor outside these operating limits may result in 

permanent damage to the processor and potentially other components in the system.

NOTES:
1.

The TDP specification should be used to design the processor thermal solution. The TDP is 
not the maximum theoretical power the processor can generate. 

2.

Not 100% tested. These power specifications are determined by characterization of the 
processor currents at higher temperatures and extrapolating the values for the 
temperature indicated.

3.

As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal 
Monitor’s automatic mode is used to indicate that the maximum T

J

 has been reached. 

Refer to 

 for more details.

4.

The Intel Thermal Monitor automatic mode must be enabled for the processor to operate 
within specifications.

TDP

T2060

1.60 GHz & HFM Vcc

31

W

At 100°C

Notes 1, 4, 5

TDP

T2080

1.73 GHz & HFM Vcc

31

W

At 100°C

Notes 1, 4, 5

TDP

T2130

1.86 GHz & HFM Vcc

31

W

At 100°C

Notes 1, 4, 5

P

AH,

P

SGNT

Auto Halt, Stop Grant Power
at HFM V

CC

at LFM V

CC

15.8

4.8

W

At 50°C

Note 2

P

SLP

Sleep Power 
at HFM V

CC

at LFM V

CC

15.5

4.7

W

At 50°C

Note 2

P

DSLP

Deep Sleep Power 
at HFM V

CC

at LFM V

CC

10.5

3.4

W

At 35°C

Note 2

T

J

Junction Temperature

0

100

°C

Notes  3,  4