Intel CM8063501287403 User Manual
Overview
Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families
11
Datasheet Volume One of Two
1
Overview
1.1
Introduction
The Intel® Xeon® processor E5-1600 v2/E5-2600 v2 product families datasheet-
Volume One provides DC electrical specifications, signal integrity, differential signaling
specifications, land and signal definitions, and an overview of additional processor
feature interfaces.
Volume One provides DC electrical specifications, signal integrity, differential signaling
specifications, land and signal definitions, and an overview of additional processor
feature interfaces.
This document is intended to be distributed as a part of the complete document which
consists of two volumes. The structure and scope of the two volumes are provided in
consists of two volumes. The structure and scope of the two volumes are provided in
The Intel® Xeon® processor E5-1600 v2/E5-2600 v2 product families are the next
generation of 64-bit, multi-core enterprise processors built on 22-nanometer process
technology. Throughout this document, the Intel® Xeon® processor E5-1600 v2/E5-
2600 v2 product families may be referred to as simply the processor. Where
information differs between the EP SKUs, this document uses specific Intel® Xeon®
processor E5-1600 v2 product family and Intel® Xeon® processor E5-2600 v2 product
family notation. Based on the low-power/high performance 3rd Generation Intel®
Core™ Processor Family microarchitecture, the processor is designed for a two-chip
platform as opposed to the traditional three-chip platforms (processor, MCH, and ICH).
The two-chip platform consists of a processor and the Platform Controller Hub (PCH)
and enables higher performance, easier validation, and improved x-y footprint.
generation of 64-bit, multi-core enterprise processors built on 22-nanometer process
technology. Throughout this document, the Intel® Xeon® processor E5-1600 v2/E5-
2600 v2 product families may be referred to as simply the processor. Where
information differs between the EP SKUs, this document uses specific Intel® Xeon®
processor E5-1600 v2 product family and Intel® Xeon® processor E5-2600 v2 product
family notation. Based on the low-power/high performance 3rd Generation Intel®
Core™ Processor Family microarchitecture, the processor is designed for a two-chip
platform as opposed to the traditional three-chip platforms (processor, MCH, and ICH).
The two-chip platform consists of a processor and the Platform Controller Hub (PCH)
and enables higher performance, easier validation, and improved x-y footprint.
This generation of processor introduces the High-Core count (HCC), Mid-Core count
(MCC), and Low-Core count (LCC) die size terminology to the SKU models. The table
below summarizes the die size associated with the processor TDP, Model Number, and
Core Count.
(MCC), and Low-Core count (LCC) die size terminology to the SKU models. The table
below summarizes the die size associated with the processor TDP, Model Number, and
Core Count.
Table 1-1.
HCC, MCC, and LCC SKU Table Summary
Die Size
TDP (W)
Model Number
Core Count
High-Core Count
130W 1U
E5-2697 v2
12
115W 1U
E5-2695 v2
12
Mid-Core Count
150W WS
E5-2687W v2
8
130W 1U
E5-2690 v2
10
130W 2U
E5-2687W v2
E5-2667 v2
8
130W 2U
E5-2643 v2
6
115W 1U
E5-2680 v2
E5-2670 v2
E5-2670 v2
10
95W 1U
E5-2660 v2
10
95W 1U
E5-2650 v2
E5-2640 v2
E5-2640 v2
8
70W 1U
E5-2650L v2
10