DELL E23S Series User Manual
DIMM
Type
DIMMs
Populated/
Channel (DPC)
DIMM Size
Operating Frequency (in MT/s)
Maximum DIMM Rank/
Channel
DDR3 (1.5 V)
DDR3 (1.35 V)
2
32 GB / 64 GB
1600
1333
Quad rank physical
3
32 GB / 64 GB
1333 and 1066
Not Applicable
Quad rank physical
General Memory Module Installation Guidelines
Your system supports Flexible Memory Configuration, enabling the system to be configured and run in any valid chipset
architectural configuration. The following are the recommended guidelines for best performance:
architectural configuration. The following are the recommended guidelines for best performance:
•
RDIMMs and LRDIMMs must not be mixed.
•
x4 and x8 DRAM based DIMMs can be mixed. For more information, see Mode-Specific Guidelines.
•
Populate only one quad-rank RDIMM per channel. The quad-rank RDIMM must be populated in the first slot with
white release levers, while the second and third slots remain empty.
•
Populate up to three dual- or single-rank RDIMMs per channel.
•
Up to three quad rank LRDIMMs can be populated per channel.
•
Up to three LRDIMMs can be populated regardless of rank count.
•
Populate DIMM sockets only if a processor is installed. For dual-processor systems, sockets A1 to A12, B1 to B12
and sockets C1 to C12, D1 to D12 are available. Each processor requires a minimum of 2 DIMMs, which must be
identical.
•
Populate all sockets with white release lever first, then black, and then green.
•
Populate the sockets by highest rank count in the following order — first in sockets with white release levers, then
black, and then green. For example, if you want to mix quad-rank and dual-rank LRDIMMs, populate quad-rank
LRDIMMs in the sockets with white release tabs and dual-rank LRDIMMs in the sockets with black release tabs.
•
The memory configuration for each processor should be identical. For example, if you populate socket A1 and B1 for
processor 1, then populate socket C1 and D1 for processor 2, and so on.
•
Memory modules of different sizes can be mixed provided that other memory population rules are followed (for
example, 4 GB and 8 GB, and 16 GB memory modules can be mixed).
•
Populate four DIMMs per processor (one DIMM per channel) at a time to maximize performance.
•
If memory modules with different speeds are installed, they will operate at the speed of the slowest installed
memory module(s) or slower depending on system DIMM configuration.
Mode-Specific Guidelines
Four memory channels are allocated to each processor. The allowable configurations depend on the memory mode
selected.
selected.
NOTE: x4 and x8 DRAM based DIMMs can be mixed providing support for RAS features. However, all guidelines
for specific RAS features must be followed. x4 DRAM based DIMMs retain Single Device Data Correction (SDDC)
in memory optimized (independent channel) mode. x8 DRAM based DIMMs require Advanced ECC mode to gain
SDDC.
for specific RAS features must be followed. x4 DRAM based DIMMs retain Single Device Data Correction (SDDC)
in memory optimized (independent channel) mode. x8 DRAM based DIMMs require Advanced ECC mode to gain
SDDC.
The following sections provide additional slot population guidelines for each mode.
Advanced ECC (Lockstep)
Advanced ECC mode extends SDDC from x4 DRAM based DIMMs to both x4 and x8 DRAMs. This protects against single
DRAM chip failures during normal operation.
Memory installation guidelines:
Memory installation guidelines:
43