Intel X3370 AT80569KJ080N Data Sheet
Product codes
AT80569KJ080N
Package Mechanical Specifications
40
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
3.1.1
Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted to either the
topside or land-side of the package substrate. See
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted to either the
topside or land-side of the package substrate. See
for keep-
out zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in.
manufacturing efficiencies but will remain within the component keep-in.
3.1.2
Package Loading Specifications
provides dynamic and static load specifications for the processor package.
These mechanical maximum load limits should not be exceeded during heatsink
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solution. The minimum loading specification must be
maintained by any thermal and mechanical solutions.
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solution. The minimum loading specification must be
maintained by any thermal and mechanical solutions.
.
3.1.3
Package Handling Guidelines
includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
handling loads may be experienced during heatsink removal.
3.1.4
Package Insertion Specifications
The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
Table 3-1.
Processor Loading Specifications
Parameter
Minimum
Maximum
Notes
Static
80 N [17 lbf]
311 N [70 lbf]
1, 2, 3
Notes:
1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2. This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the
minimum specified load on the processor package.
3. These specifications are based on limited testing for design characterization. Loading limits are for the package
only and do not include the limits of the processor socket.
Dynamic
—
756 N [170 lbf]
4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement.
Table 3-2.
Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
311 N [70 lbf]
1, 2
Notes:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. These guidelines are based on limited testing for design characterization.
Tensile
111 N [25 lbf]
, 3
3. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
Torque
3.95 N-m [35 lbf-in]
, 4
4. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.