Intel L5410 AT80574JJ053N Data Sheet

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Processor Thermal Features). Systems that implement fan speed control must be 
designed to use this data. Systems that do not alter the fan speed only need to 
guarantee the case temperature meets the thermal profile specifications.

The Quad-Core Intel® Xeon® Processor X5482, and Quad-Core Intel® Xeon® 
Processor E5400 Series, and Quad-Core Intel® Xeon® Processor L5400 Series support 
a single Thermal Profile (see

, and 

). With this Thermal Profile, it is expected that the Thermal 

Control Circuit (TCC) would only be activated for very brief periods of time when 
running the most power-intensive applications. Refer to the Quad-Core Intel® Xeon® 
Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG) for details on 
system thermal solution design, thermal profiles and environmental considerations.

The Quad-Core Intel® Xeon® Processor L5408 supports a Thermal Profile with nominal 
and short-term conditions designed to meet NEBS level 3 compliance (see 

Operation at either thermal profile should result in virtually no TCC activation. Refer to 
the Quad-Core Intel® Xeon® Processor L5408 Series in Embedded Applications 
Thermal/Mechanical Design Guidelines (TMDG).

The Quad-Core Intel® Xeon® Processor X5400 Series supports a dual Thermal Profile, 
either of which can be implemented. Both ensure adherence to the Intel reliability 
requirements. Thermal Profile A (see 

) is representative of a 

volumetrically unconstrained thermal solution (that is, industry enabled 2U heatsink). 
In this scenario, it is expected that the Thermal Control Circuit (TCC) would only be 
activated for very brief periods of time when running the most power intensive 
applications. Thermal Profile B (see 

) is indicative of a constrained 

thermal environment (that is, 1U form factor). Because of the reduced cooling 
capability represented by this thermal solution, the probability of TCC activation and 
performance loss is increased. Additionally, utilization of a thermal solution that does 
not meet Thermal Profile B will violate the thermal specifications and may result in 
permanent damage to the processor. Intel has developed these thermal profiles to 
allow customers to choose the thermal solution and environmental parameters that 
best suit their platform implementation. Refer to the Quad-Core Intel® Xeon® 
Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG) for details on 
system thermal solution design, thermal profiles and environmental considerations.

The upper point of the thermal profile consists of the Thermal Design Power (TDP) 
defined in 

 for the Quad-Core Intel® Xeon® Processor X5482, 

the Quad-Core Intel® Xeon® Processor X5400 Series, 

 for the Quad-Core 

Intel® Xeon® Processor E5400 Series, and 

 for the Quad-Core Intel® Xeon® 

Processor L5400 Series and the associated T

CASE

 values. The lower point of the thermal 

profile is the T

CASE_MAX

 at 0 W power (or no power draw)

Analysis indicates that real applications are unlikely to cause the processor to consume 
maximum power dissipation for sustained time periods. Intel recommends that 
complete thermal solution designs target the Thermal Design Power (TDP) indicated in 

 for the Quad-Core Intel® Xeon® Processor X5482 (C-step) and Quad-Core 

Intel® Xeon® Processor X5492, 

 for the Quad-Core Intel® 

Xeon® Processor X5400 Series, 

 for the Quad-Core Intel® Xeon® Processor 

E5400 Series and 

Quad-Core Intel® Xeon® Processor L5400 Series instead of 

the maximum processor power consumption. The Thermal Monitor feature is intended 
to help protect the processor in the event that an application exceeds the TDP 
recommendation for a sustained time period. For more details on this feature, refer to 

. To ensure maximum flexibility for future requirements, systems should be 

designed to the Flexible Motherboard (FMB) guidelines, even if a processor with lower