Intel Desktop Board D945GRW BLKD945GRWLK User Manual
Product codes
BLKD945GRWLK
Technical Reference
65
2.10 Thermal Considerations
CAUTION
This board requires the use of a Type II (Low Profile) Thermal Module for the processor.
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have
been tested with Intel desktop boards please refer to the following website:
and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have
been tested with Intel desktop boards please refer to the following website:
All responsibility for determining the adequacy of any thermal or system design remains solely with
the reader. Intel makes no warranties or representations that merely following the instructions
presented in this document will result in a system with adequate thermal performance.
the reader. Intel makes no warranties or representations that merely following the instructions
presented in this document will result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating temperature.
Failure to do so could cause components to exceed their maximum case temperature and
malfunction. For information about the maximum operating temperature, see the environmental
specifications in Section 2.12.
Failure to do so could cause components to exceed their maximum case temperature and
malfunction. For information about the maximum operating temperature, see the environmental
specifications in Section 2.12.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do
so may result in damage to the voltage regulator circuit. The processor voltage regulator area
(item E in Figure 23) can reach a temperature of up to 85
so may result in damage to the voltage regulator circuit. The processor voltage regulator area
(item E in Figure 23) can reach a temperature of up to 85
o
C in an open chassis.
Figure 23 shows the locations of the localized high temperature zones.