Intel Xeon E7420 AD80583QH0468M Data Sheet
Product codes
AD80583QH0468M
Intel® Xeon® Processor 7400 Series Datasheet
51
Mechanical Specifications
3
Mechanical Specifications
The Intel® Xeon® Processor 7400 Series is packaged in a lead free FC-mPGA8 package
that interfaces with the motherboard via a mPGA604 socket. The package consists of
the processor die mounted on a substrate pin-carrier. An IHS is attached to the
package substrate and die and serves as the mating surface for processor component
thermal solutions, such as a heatsink.
that interfaces with the motherboard via a mPGA604 socket. The package consists of
the processor die mounted on a substrate pin-carrier. An IHS is attached to the
package substrate and die and serves as the mating surface for processor component
thermal solutions, such as a heatsink.
shows a sketch of the processor
package components and how they are assembled together.
The package components shown in
1. IHS
2. Processor die
3. FC-mPGA8 package
4. Pin-side capacitors
5. Package pin
2. Processor die
3. FC-mPGA8 package
4. Pin-side capacitors
5. Package pin
Note:
is not to scale and is for reference only. The mPGA604 socket is not shown.
3.1
Package Mechanical Drawing
The drawings include dimensions necessary to design a thermal solution for the
processor. These dimensions include:
processor. These dimensions include:
1. Package reference with tolerances (total height, length, width, etc.)
2. IHS parallelism and tilt
3. Pin dimensions
4. Top-side and back-side component keepout dimensions
5. Reference datums
2. IHS parallelism and tilt
3. Pin dimensions
4. Top-side and back-side component keepout dimensions
5. Reference datums
All drawing dimensions are in mm [in].
Figure 3-1. Processor Package Assembly Sketch