Intel E5440 AT80574KJ073N Data Sheet

Product codes
AT80574KJ073N
Page of 118
Quad-Core Intel® Xeon® Processor 5400 Series Electrical Specifications
40
The AGTL+ reference voltages (GTLREF_DATA_MID, GTLREF_DATA_END, 
GTLREF_ADD_MID, and GTLREF_ADD_END) must be generated on the baseboard 
using high precision voltage divider circuits. Refer to the appropriate platform design 
guidelines for implementation details.
Notes:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
The tolerances for this specification have been stated generically to enable system designer to calculate the 
minimum values across the range of V
TT
.
3.
GTLREF_DATA_MID, GTLREF_DATA_END, GTLREF_ADD_MID, and GTLREF_ADD_END is generated from V
TT
 
on the baseboard by a voltage divider of 1% resistors. The minimum and maximum specifications account 
for this resistor tolerance. Refer to the appropriate platform design guidelines for implementation details. 
The V
TT
 referred to in these specifications is the instantaneous V
TT
.
4.
R
TT
 is the on-die termination resistance measured at V
OL
 of the AGTL+ output driver. Measured at 
0.31*V
TT
. R
TT
 is connected to V
TT
 on die. Refer to processor I/O Buffer Models for I/V characteristics.
5.
COMP resistance must be provided on the system board with 1% resistors. See the applicable platform 
design guide for implementation details.
Notes:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
Crossing Voltage is defined as the instantaneous voltage value when the rising edge of BCLK0 is equal to 
the falling edge of BCLK1.
3.
V
Havg
 is the statistical average of the V
H
 measured by the oscilloscope.
4.
Overshoot is defined as the absolute value of the maximum voltage.
5.
Undershoot is defined as the absolute value of the minimum voltage.
6.
Ringback Margin is defined as the absolute voltage difference between the maximum Rising Edge Ringback 
and the maximum Falling Edge Ringback.
Table 2-19. AGTL+ Bus Voltage Definitions
Symbol
Parameter
Min
Typ
Max
Units
Notes
1
GTLREF_DATA_MID, 
GTLREF_DATA_END
Data Bus Reference 
Voltage
0.98 * 
0.667 * V
TT
0.667 * 
V
TT
1.02*0.667 
* V
TT
V
2,  3
GTLREF_ADD_MID, 
GTLREF_ADD_END
Address Bus Reference 
Voltage
0.98 * 
0.667 * V
TT
0.667 * 
V
TT
1.02*0.667 
* V
TT
V
2,  3
R
TT
Termination 
Resistance (pull up)
45
50
55
Ω
4
COMP
COMP Resistance
49.4
49.9
50.4
Ω
5
Table 2-20. FSB Differential BCLK Specifications
Symbol
Parameter
Min
Typ
Max
Unit
Figure
Notes
1
V
L
Input Low Voltage
-0.150
0.0
0.150
V
V
H
Input High Voltage
0.660
0.710
0.850
V
V
CROSS(abs)
Absolute Crossing Point
0.250
0.350
0.550
V
2,9
V
CROSS(rel)
Relative Crossing Point
0.250 + 
0.5 * 
(V
Havg
 - 
0.700)
N/A
0.550 + 
0.5 * 
(V
Havg
 - 
0.700)
V
3,8,9,11
Δ
 VCROSS
Range of Crossing 
Points
N/A
N/A
0.140
V
V
OS
Overshoot
N/A
N/A
1.150
V
4
V
US
Undershoot
-0.300
N/A
N/A
V
5
V
RBM
Ringback Margin
0.200
N/A
N/A
V
6
V
TR
Threshold Region
V
CROSS
 - 
0.100
N/A
V
CROSS
 
+ 0.100
V
7
I
LI
Input Leakage Current
N/A
N/A
± 100
μA
10
ERRefclk-diffRrise
ERRefclk-diff-Fall
Differential Rising and 
falling edge rates
0.6
4
V/ns
12