Intel E5440 AT80574KJ073N Data Sheet
Product codes
AT80574KJ073N
83
Thermal Specifications
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC. Please refer to the loadline specifications in
2.
Thermal Design Power (TDP) should be used for the processor thermal solution design targets. TDP is not
the maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based on silicon characterization.
4.
Power specifications are defined at all VIDs found in
. The Quad-Core Intel® Xeon® Processor
X5400 Series may be shipped under multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1.
Thermal Profile A is representative of a volumetrically unconstrained platform. Please refer to
for
discrete points that constitute the thermal profile.
2.
Implementation of the Quad-Core Intel® Xeon® Processor X5400 Series
Thermal Profile A should result in
virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet Thermal Profile A
will result in increased probability of TCC activation and may incur measurable performance loss. (See
for details on TCC activation).
3.
Thermal Profile B is representative of a volumetrically constrained platform. Please refer to
for
discrete points that constitute the thermal profile.
4.
Implementation of the Quad-Core Intel® Xeon® Processor X5400 Series
Thermal Profile B will result in
increased probability of TCC activation and measurable performance loss. Furthermore, utilization of
thermal solutions that do not meet Thermal Profile B do not meet the processor’s thermal specifications
and may result in permanent damage to the processor.
5.
Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines
(TMDG) for system and environmental implementation details.
Table 6-3.
Quad-Core Intel® Xeon® Processor X5400 Series Thermal Specifications
Core
Frequency
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
120
5
;
1, 2, 3, 4, 5
Figure 6-2. Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profiles A and B
40
45
50
55
60
65
70
75
0
10
20
30
40
50
60
70
80
90
100
110
120
Pow er [W]
Tc
a
s
e
[
C
]
TCASE_MAX is a thermal solution design point. In actuality, units
will not significantly exceed TCASE_MAX_A due to TCC activation.
will not significantly exceed TCASE_MAX_A due to TCC activation.
Thermal Profile A
Y = 0.168*x + 42.8
Y = 0.168*x + 42.8
Thermal Profile B
Y = 0.221*x + 43.5
Y = 0.221*x + 43.5
40
45
50
55
60
65
70
75
0
10
20
30
40
50
60
70
80
90
100
110
120
Pow er [W]
Tc
a
s
e
[
C
]
40
45
50
55
60
65
70
75
0
10
20
30
40
50
60
70
80
90
100
110
120
Pow er [W]
Tc
a
s
e
[
C
]
TCASE_MAX is a thermal solution design point. In actuality, units
will not significantly exceed TCASE_MAX_A due to TCC activation.
will not significantly exceed TCASE_MAX_A due to TCC activation.
Thermal Profile A
Y = 0.168*x + 42.8
Y = 0.168*x + 42.8
Thermal Profile B
Y = 0.221*x + 43.5
Y = 0.221*x + 43.5