IBM Intel Xeon E5504 46D1351 User Manual
Product codes
46D1351
Introduction
Intel® Xeon® Processor 5500 Series Datasheet, Volume 2
16
• Eye Definitions — The eye at any point along the data channel is defined to be the
creation of overlapping of a large number of Unit Interval of the data signal and
timing width measured with respect to the edges of a separate clock signal at any
other point. Each differential signal pair by combining the D+ and D- signals
produces a signal eye.
timing width measured with respect to the edges of a separate clock signal at any
other point. Each differential signal pair by combining the D+ and D- signals
produces a signal eye.
• 1366-land LGA package — The processor is available in a Land Grid Array (LGA)
package, consisting of the processor die mounted on a land grid array substrate
with an integrated heat spreader (IHS).
with an integrated heat spreader (IHS).
• Functional Operation — Refers to the normal operating conditions in which all
processor specifications, including DC, AC, system bus, signal quality, mechanical,
and thermal, are satisfied.
and thermal, are satisfied.
• Integrated Memory Controller (IMC) — A memory controller that is integrated
in the processor silicon.
• Integrated Heat Spreader (IHS) — A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
interface with the processor at the IHS surface.
• Intel
®
64 Architecture — An enhancement to Intel's IA-32 architecture, allowing
the processor to execute operating systems and applications written to take
advantage of Intel 64. Further details on Intel 64 architecture and programming
model can be found at
advantage of Intel 64. Further details on Intel 64 architecture and programming
model can be found at
http://developer.intel.com/technology/intel64/
.
• Intel
®
QuickPath Interconnect – A cache-coherent, link-based interconnect
specification for Intel processor, chipset, and I/O bridge components. Sometimes
abbreviated as Intel QPI.
abbreviated as Intel QPI.
• Intel® QPI — Abbreviation for Intel® QuickPath Interconnect.
• Intel
• Intel
®
Virtualization Technology (Intel
®
VT) — A set of hardware
enhancements to Intel server and client platforms that can improve virtualization
solutions. Intel VT provides a foundation for widely-deployed virtualization
solutions and enables more robust hardware assisted virtualization solutions. More
information can be found at:
solutions. Intel VT provides a foundation for widely-deployed virtualization
solutions and enables more robust hardware assisted virtualization solutions. More
information can be found at:
http://www.intel.com/technology/virtualization/
• Jitter — Any timing variation of a transition edge or edges from the defined Unit
Interval.
• LGA1366 Socket — The processor (in the LGA-1366 package) mates with the
system board through this surface mount, 1366-contact socket.
• Mirror Port - Pads located on the top side of the processor package used to
provide logic analyzer probing access for Intel QPI signal analysis.
• Non-core — The portion of the processor comprising the shared cache, IMC and
Intel QPI Link interface.
• OEM — Original Equipment Manufacturer.
• Storage Conditions — Refers to a non-operational state. The processor may be
• Storage Conditions — Refers to a non-operational state. The processor may be
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor lands should not be
connected to any supply voltages, have any I/Os biased, or receive any clocks.
exposed to free air. Under these conditions, processor lands should not be
connected to any supply voltages, have any I/Os biased, or receive any clocks.
• Intel Xeon Processor 5500 Series — The 2S server/workstation product,
including processor substrate and integrated heat spreader (IHS).