Intel X5460 AT80574KJ087N Data Sheet
Product codes
AT80574KJ087N
115
Boxed Processor Specifications
around the heatsink. It is assumed that a 40°C T
LA
is met. This requires a superior
chassis design to limit the T
RISE
at or below 5°C with an external ambient temperature
of 35°C. These specifications apply to both copper and aluminum heatsink solutions.
Following these guidelines allows the designer to meet Quad-Core Intel® Xeon®
Processor 5400 Series Thermal Profile and conform to the thermal requirements of the
processor.
Following these guidelines allows the designer to meet Quad-Core Intel® Xeon®
Processor 5400 Series Thermal Profile and conform to the thermal requirements of the
processor.
8.3.2.2
1U Passive/3U+ Active Combination Heat Sink Solution (Pedestal
Active)
The active configuration of the combination solution is designed to help pedestal
chassis users to meet the thermal processor requirements without the use of chassis
ducting. It may be still be necessary to implement some form of chassis air guide or air
duct to meet the T
chassis users to meet the thermal processor requirements without the use of chassis
ducting. It may be still be necessary to implement some form of chassis air guide or air
duct to meet the T
LA
temperature of 40
°
C depending on the pedestal chassis layout.
Also, while the active thermal solution design will mechanically fit into a 2U volumetric,
it may not provide adequate airflow. This is due to the requirement of additional space
at the top of the thermal solution to allow sufficient airflow into the heat sink fan. Use
of the active configuration in a 2U rackmount chassis is not recommended.
it may not provide adequate airflow. This is due to the requirement of additional space
at the top of the thermal solution to allow sufficient airflow into the heat sink fan. Use
of the active configuration in a 2U rackmount chassis is not recommended.
It is recommended that the ambient air temperature outside of the chassis be kept at
or below 35°C. The air passing directly over the processor thermal solution should not
be preheated by other system components. Meeting the processor’s temperature
specification is the responsibility of the system integrator.
or below 35°C. The air passing directly over the processor thermal solution should not
be preheated by other system components. Meeting the processor’s temperature
specification is the responsibility of the system integrator.
8.3.2.3
2U Passive Heat Sink Solution (2U+ Rack or Pedestal)
In the 2U+ passive configuration, it is assumed that a chassis duct will be implemented
to provide a minimum airflow of 27 cfm at 0.182 in. H
to provide a minimum airflow of 27 cfm at 0.182 in. H
2
O (45.9 m
3
/hr at 45.3 Pa) of
flow impedance. The duct should be carefully designed to minimize the airflow bypass
around the heatsink. These specifications apply to both copper and aluminum heatsink
solutions. The T
around the heatsink. These specifications apply to both copper and aluminum heatsink
solutions. The T
LA
temperature of 40
°
C should be met. This may require the use of
superior design techniques to keep T
RISE
at or below 5°C based on an ambient external
temperature of 35°C.
8.4
Boxed Processor Contents
A direct chassis attach method must be used to avoid problems related to shock and
vibration. The board must not bend beyond specification in order to avoid damage. The
boxed processor contains the components necessary to solve both issues. The boxed
processor will include the following items:
vibration. The board must not bend beyond specification in order to avoid damage. The
boxed processor contains the components necessary to solve both issues. The boxed
processor will include the following items:
• Quad-Core Intel® Xeon® Processor 5400 Series
• Unattached heat sink solution
• Four screws, four springs, and four heat sink standoffs (all captive to the heat sink)
• Foam air bypass pad and skirt (included with 1U passive/3U+ active solution)
• Thermal interface material (pre-applied on heat sink)
• Installation and warranty manual
• Intel Inside Logo
• Unattached heat sink solution
• Four screws, four springs, and four heat sink standoffs (all captive to the heat sink)
• Foam air bypass pad and skirt (included with 1U passive/3U+ active solution)
• Thermal interface material (pre-applied on heat sink)
• Installation and warranty manual
• Intel Inside Logo
Other items listed in
that are required to complete this solution will be
shipped with either the chassis or boards. They are as follows:
• CEK Spring (supplied by baseboard vendors)
• Chassis standoffs (supplied by chassis vendors)
• Chassis standoffs (supplied by chassis vendors)