Crucial 3GB kit Ballistix Tracer 240-pin DIMM BL3KIT12864TR1608 Data Sheet
Product codes
BL3KIT12864TR1608
1GB / 2GB (x64) UNBUFFERED DDR3 SDRAM DIMM
Micron Technology, reserves the right to change products or specifications without notice.
BL0009.fm - Rev. 01/07/09
1
©2008 Micron Technology
1GB / 2GB (x64) UNBUFFERED DDR3 SDRAM DIMM
Crucial® Ballistix™ products are warranted to meet the datasheet specifications as found on its web page
Some system configurations may not be designed to operate or may not operate at the published Crucial Ballistix memory speed andtiming
settings. Overclocking, running your system faster than the speed for which it was designed or the published speed, or otherwise modifying
your system timing may result in damage to computer components and Crucial disclaims any and all liability for such damage.
settings. Overclocking, running your system faster than the speed for which it was designed or the published speed, or otherwise modifying
your system timing may result in damage to computer components and Crucial disclaims any and all liability for such damage.
©2008 Micron Technology, Inc. All rights reserved. Information is subject to change without notice. Micron, Crucial, the Crucial logo,
Ballistix, Ballistix Tracer, and the Ballistix Tracer logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
their respective owners.
Ballistix, Ballistix Tracer, and the Ballistix Tracer logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
their respective owners.
DDR3 UNBUFFERED SDRAM DIMM
BL12864TR
BL25664TR
BL25664TR
Features
• 240-pin, unbuffered dual in-line memory module
(UDIMM)
• Physical dimensions are compliant to JEDEC MO-269B
• Fast data transfer rates: PC3-10600 and PC3-12800
• 1GB (128 Meg x 64) and 2GB (256 Meg x 64)
• Exclusively designed for high-performance systems
• Critical performance parameters tested for
• Fast data transfer rates: PC3-10600 and PC3-12800
• 1GB (128 Meg x 64) and 2GB (256 Meg x 64)
• Exclusively designed for high-performance systems
• Critical performance parameters tested for
functionality
• Speed verification performed in-system
• V
• V
DD
= V
DD
Q = +1.65V ±0.075V
• V
DDSPD
= +3.0V to +3.6V
• Reset pin for improved system stability
• Nominal and dynamic on-die termination (ODT) for
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• 8 internal device banks for concurrent operation
• Fixed burst length of 8 (BL8) and burst chop of 4 (BC4)
• Fixed burst length of 8 (BL8) and burst chop of 4 (BC4)
via the mode register
• Adjustable data-output drive strength
• Serial Presence-Detect (SPD) EEPROM
• Gold edge contacts
• RoHS compliant
• Fly-by topology
• Terminated command, address, and control bus
• Serial Presence-Detect (SPD) EEPROM
• Gold edge contacts
• RoHS compliant
• Fly-by topology
• Terminated command, address, and control bus
Timing Parameters
Module
Module
Latency
Marking
Bandwidth
(CL -
t
RCD -
t
RP)
1337
10.6 GB/s
7 - 7 - 7 - 24*
1608
12.8 GB/s
8 - 8 - 8 - 24*
Part Numbers
Module
Voltage
Memory Clock/
Banking
Component
Part Number
Density
(V
DD
)
Data Bit Rate
Configuration
Configuration
BL12864TR1337
1GB
1.65V
1.50ns/1333 MT/s
Single
128 Meg x 8
BL12864TR1608
1GB
1.65V
1.25ns/1600 MT/s
Single
128 Meg x 8
BL25664TR1337
2GB
1.65V
1.50ns/1333 MT/s
Dual
128 Meg x 8
BL25664TR1608
2GB
1.65V
1.25ns/1600 MT/s
Dual
128 Meg x 8
* Performance is verified during testing.
• Aluminum heat spreader
• Red LEDs showing memory activity
• Red ground effects LEDs
• 1.18” (30mm) PCB Height
• XMP Profiles Programmed to SPD
• Red LEDs showing memory activity
• Red ground effects LEDs
• 1.18” (30mm) PCB Height
• XMP Profiles Programmed to SPD