Intel Xeon E5405 BX80574E5405 User Manual

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

11

T

CONTROL

A processor unique value for use in fan speed control mechanisms. T

CONTROL

 is a 

temperature specification based on a temperature reading from the processor’s Digital 

Thermal Sensor. T

CONTROL

 can be described as a trigger point for fan speed control 

implementation.

 

T

CONTROL

 = -T

OFFSET

.

T

OFFSET

An offset value from the TCC activation temperature value programmed into each 

processor during manufacturing and can be obtained by reading the 

IA_32_TEMPERATURE_TARGET MSR. This is a static and a unique value. Refer to the 

RS - Wolfdale Processor Family BIOS Writers Guide (BWG) for further details.

TDP

Thermal Design Power: Thermal solution should be designed to dissipate this target 

power level. TDP is not the maximum power that the processor can dissipate.

Thermal Monitor

A feature on the processor that can keep the processor’s die temperature within factory 

specifications under normal operating conditions.

Thermal Profile

Line that defines case temperature specification of a processor at a given power level.

TIM

Thermal Interface Material: The thermally conductive compound between the heatsink 

and the processor case. This material fills the air gaps and voids, and enhances the 

transfer of the heat from the processor case to the heatsink.

T

LA

The measured ambient temperature locally surrounding the processor. The ambient 

temperature should be measured just upstream of a passive heatsink or at the fan inlet 

for an active heatsink. 

T

SA

The system ambient air temperature external to a system chassis. This temperature is 

usually measured at the chassis air inlets.

U

A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U 

equals 3.50 in, etc.