Intel Xeon E5405 BX80574E5405 User Manual

Product codes

BX80574E5405

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Contents

Introduction ..............................................................................................................9
1.1

Objective ...........................................................................................................9

1.2

Scope ................................................................................................................9

1.3

References .........................................................................................................9

1.4

Definition of Terms ............................................................................................ 10

Thermal/Mechanical Reference Design.................................................................... 13
2.1

Mechanical Requirements ................................................................................... 13
2.1.1

Processor Mechanical Parameters ............................................................. 13

2.1.2

Quad-Core Intel® Xeon® Processor 5400 Series Package............................ 14

2.1.3

Quad-Core Intel® Xeon® Processor 5400 Series Considerations................... 18

2.2

Processor Thermal Parameters and Features ......................................................... 19
2.2.1

Thermal Control Circuit and TDP............................................................... 19

2.2.2

Digital Thermal Sensor............................................................................ 20

2.2.3

Platform Environmental Control Interface (PECI) ........................................ 21

2.2.4

Multiple Core Special Considerations ......................................................... 21

2.2.5

Thermal Profile ...................................................................................... 24

2.2.6

TCONTROL Definition .............................................................................. 25

2.2.7

Thermal Profile Concepts for the Quad-Core Intel® Xeon®

Processor 5400 Series............................................................................. 26

2.2.8

Performance Targets............................................................................... 28

2.3

Fan Fail Guidelines ............................................................................................ 32

2.4

Characterizing Cooling Solution Performance Requirements..................................... 33
2.4.1

Fan Speed Control.................................................................................. 33

2.4.2

Processor Thermal Characterization Parameter Relationships........................ 34

2.4.3

Chassis Thermal Design Considerations ..................................................... 36

2.5

Thermal/Mechanical Reference Design Considerations ............................................ 37
2.5.1

Heatsink Solutions.................................................................................. 37

2.5.2

Thermal Interface Material....................................................................... 38

2.5.3

Summary .............................................................................................. 38

2.5.4

Assembly Overview of the Intel Reference Thermal Mechanical Design........... 39

2.5.5

Thermal Solution Performance Characteristics ............................................ 41

2.5.6

Thermal Profile Adherence ....................................................................... 42

2.5.7

Components Overview ............................................................................ 45

2.5.8

Boxed Active Thermal Solution for the Quad-Core Intel®

Xeon® Processor 5400 Series Thermal Profile ............................................ 49

1U Alternative Heatsink Thermal/Mechanical Design............................................... 53
A.1

Component Overview......................................................................................... 53

A.2

Thermal Solution Performance Characterics .......................................................... 54

A.3

Thermal Profile Adherence .................................................................................. 54

Mechanical Drawings............................................................................................... 57

Heatsink Clip Load Methodology .............................................................................. 83
C.1

Overview ......................................................................................................... 83

C.2

Test Preparation................................................................................................ 83
C.2.1

Heatsink Preparation .............................................................................. 83

C.2.2

Typical Test Equipment ........................................................................... 86

C.2.3

Test Procedure Examples ........................................................................ 86

C.2.4

Time-Zero, Room Temperature Preload Measurement ................................. 86

C.2.5

Preload Degradation under Bake Conditions ............................................... 87