Intel Xeon E5405 BX80574E5405 User Manual

Product codes
BX80574E5405
Page of 100
Thermal/Mechanical Reference Design
48
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
2.5.7.3
CEK Spring
The CEK spring, which is attached on the secondary side of the baseboard, is made 
from 0.80 mm [0.0315 in.] thick 301 stainless steel half hard. Any future versions of 
the spring will be made from a similar material. The CEK spring has four embosses 
which, when assembled, rest on the top of the chassis standoffs. The CEK spring is 
located between the chassis standoffs and the heatsink standoffs. The purpose of the 
CEK spring is to provide compressive preload at the TIM interface when the baseboard 
is pushed down upon it. This spring does not function as a clip of any kind. The two 
tabs on the spring are used to provide the necessary compressive preload for the TIM 
when the whole solution is assembled. The tabs make contact on the secondary side of 
the baseboard. In order to avoid damage to the contact locations on the baseboard, the 
tabs are insulated with a 0.127 mm [0.005 in.] thick Kapton* tape (or equivalent). 
 shows an isometric view of the CEK spring design.
 for more detailed mechanical drawings of the CEK spring. 
Also, the baseboard keepout requirements shown in 
 must be met to use 
this CEK spring design.
Figure 2-24. CEK Spring Isometric View
Figure 2-25. Isometric View of CEK Spring Attachment to the Base Board
Secondary
Primary
Secondary
Primary