Intel Xeon E5405 BX80574E5405 User Manual
Product codes
BX80574E5405
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
55
1U Alternative Heatsink Thermal/Mechanical Design
x = Processor power value (W)
below shows the comparison of this reference thermal solution’s Thermal
Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile
specification. The 1U alternative solution meets the Thermal Profile with 0.5°C margin
at the upper end (TDP). By designing to Thermal Profile, it is ensured that no
measurable performance loss due to TCC activation is observed under the given
environmental conditions.
specification. The 1U alternative solution meets the Thermal Profile with 0.5°C margin
at the upper end (TDP). By designing to Thermal Profile, it is ensured that no
measurable performance loss due to TCC activation is observed under the given
environmental conditions.
§
Figure A-3. 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon®
Processor L5400 Series Thermal Profile
35
40
45
50
55
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
Tcase
(
C
)
T
C AS E_M A X
@ TD P
1U A lternative H eatsink
Y = 0.331 * X + 40
Therm al Profile
Y = 0.298 * X + 43.2
60
65