Kingston Technology 6GB, 1800MHz, DDR3, CL9 (9-9-9-27), DIMM, (Kit of 3), XMP Tall HS w/ Fan KHX1800C9D3T1FK3/6GX Data Sheet
Product codes
KHX1800C9D3T1FK3/6GX
Memory Module Specifications
KHX1800C9D3T1FK3/6GX
6GB (2GB 256M x 64-Bit x 3 pcs.) DDR3-1800MHz
CL9 240-Pin DIMM Kit w/ Fan
CL9 240-Pin DIMM Kit w/ Fan
Kingston.com
Document No. 4805277-001.B00 07/18/11 Page 1
DESCRIPTION
Kingston’s KHX1800C9D3T1FK3/6GX is a kit of three 256M
x 64-bit 2GB (2048MB) DDR3-1800MHz CL9 SDRAM
(Synchronous DRAM) memory modules, based on sixteen
128M x 8-bit DDR3 FBGA components per module. Each
module kit supports Intel
x 64-bit 2GB (2048MB) DDR3-1800MHz CL9 SDRAM
(Synchronous DRAM) memory modules, based on sixteen
128M x 8-bit DDR3 FBGA components per module. Each
module kit supports Intel
®
XMP (Extreme Memory Profiles).
Total kit capacity is 6GB. Each module kit has been tested
to run at DDR3-1800MHz at a low latency timing of 9-9-9-27
at 1.65V. The SPDs are programmed to JEDEC standard
latency DDR3-1333MHz timing of 9-9-9 at 1.5V. Each 240-
pin DIMM uses gold contact fingers and requires +1.5V. The
JEDEC standard electrical and mechanical specifications
are as follows:
to run at DDR3-1800MHz at a low latency timing of 9-9-9-27
at 1.65V. The SPDs are programmed to JEDEC standard
latency DDR3-1333MHz timing of 9-9-9 at 1.5V. Each 240-
pin DIMM uses gold contact fingers and requires +1.5V. The
JEDEC standard electrical and mechanical specifications
are as follows:
This special kit part number includes Kingston’s HyperX
high-performance cooling fan assembly (KHX-FAN).
high-performance cooling fan assembly (KHX-FAN).
SPECIFICATIONS
CL(IDD)
9 cycles
Row Cycle Time (tRCmin)
49.5ns (min.)
Refresh to Active/Refresh
110ns
Command Time (tRFCmin)
Row Active Time (tRASmin)
36ns (min.)
Power
1.800 W (operating per module)
UL Rating
94 V - 0
Operating Temperature
0° C to 85° C
Storage Temperature
-55° C to +100° C
FEATURES
• JEDEC standard 1.5V ± 0.075V Power Supply
• VDDQ = 1.5V ± 0.075V
• 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 5,6,7,8,9,10
• Posted CAS
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 7(DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
• VDDQ = 1.5V ± 0.075V
• 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 5,6,7,8,9,10
• Posted CAS
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 7(DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does
not allow seamless read or write [either on the fly using A12
or MRS]
not allow seamless read or write [either on the fly using A12
or MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE ≤ 95°C
• Asynchronous Reset
• PCB : Height 2.401” (61.00mm) w/ heatsink, double sided
• PCB : Height 2.401” (61.00mm) w/ heatsink, double sided
component
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