Intel E5506 AT80602000798AA User Manual

Intel

®

 Xeon

®

 Processor 5500 Series Datasheet, Volume 1

91

designed to the Flexible Motherboard (FMB) guidelines, even if a processor with lower 
power dissipation is currently planned. The Adaptive Thermal Monitor feature 
must be enabled for the processor to remain within its specifications.

1.

These values are specified at V

CC_MAX

 for all processor frequencies. Systems must be designed to ensure 

the processor is not to be subjected to any static V

CC

 and I

CC

 combination wherein V

CC

 exceeds V

CC_MAX

 at 

specified ICC. Please refer to the loadline specifications in 

2.

Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the 

maximum power that the processor can dissipate. TDP is measured at maximum T

CASE

.

3.

These specifications are based on initial silicon characterization. These specifications may be further 

updated as more characterization data becomes available.

4.

Power specifications are defined at all VIDs found in 

. The Intel Xeon processor 5500 series may 

be shipped under multiple VIDs for each frequency.

5.

FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor 

frequency requirements.

1.

Intel Xeon Processor W5580 Thermal Profile is representative of a volumetrically unconstrained platform. 

Please refer to 

 for discrete points that constitute the thermal profile.

2.

Implementation of Intel Xeon Processor W5580 Thermal Profile should result in virtually no TCC activation. 

3.

Refer to the Intel® Xeon® Processor 5500 Series Thermal / Mechanical Design Guide for system and 

environmental implementation details.

Launch to FMB

130

5

See 

1, 2, 3, 4, 5