Intel Xeon E7330 LF80565QH0566M Data Sheet

Product codes

LF80565QH0566M

Document Number: 318080-002

Mechanical Specifications

The Intel

Xeon

Processor 7200 Series and 7300 Series is packaged in a FC-mPGA6

package that interfaces with the motherboard via a mPGA604 socket. The package
consists of two processor dies mounted on a substrate pin-carrier. An IHS is attached
to the package substrate and die and serves as the mating surface for processor
component thermal solutions, such as a heatsink.

Figure 3-1

shows a sketch of the

processor package components and how they are assembled together. Refer to the
mPGA604 Socket Design Guidelines for complete details on the mPGA604 socket.

The package components shown in

Figure 3-1

include the following:

1. IHS
2. Processor die
3. FC-mPGA6 package
4. Pin-side capacitors
5. Package pin

Note:

Figure 3-1

is not to scale and is for reference only. The mPGA604 socket is not shown.

3.1

Package Mechanical Drawing

The package mechanical drawings are shown in

Figure 3-2

and

Figure 3-3

. The

drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:

1. Package reference with tolerances (total height, length, width, etc.)
2. IHS parallelism and tilt
3. Pin dimensions
4. Top-side and back-side component keepout dimensions
5. Reference datums

All drawing dimension are in mm [in].

Figure 3-1. Processor Package Assembly Sketch