Intel Xeon E7330 LF80565QH0566M Data Sheet
Product codes
LF80565QH0566M
Mechanical Specifications
60
Document Number: 318080-002
3.2
Processor Component Keepout Zones
The processor may contain components on the substrate that define component
keepout zone requirements. A thermal and mechanical solution design must not
intrude into the required keepout zones. Decoupling capacitors are typically mounted
to either the topside or pin-side of the package substrate. See
keepout zone requirements. A thermal and mechanical solution design must not
intrude into the required keepout zones. Decoupling capacitors are typically mounted
to either the topside or pin-side of the package substrate. See
and
for keepout zones.