Kingston Technology 512MB, DDR RAM, HYPERX kit, PC3700, 32MX64, CL3 KHX3700K2/512 Data Sheet
Product codes
KHX3700K2/512
Memory Module Specification
Document No. 4803634-001.A00
07/10/03
KHX3700K2/512
512MB (256MB 32M x 64-Bit x 2 pcs.)
PC3700 CL3 184-Pin DIMM Kit
KEYED
Page 1
DESCRIPTION:
Kingston's KHX3700K2/512 is a kit of two 32M x 64-bit (256MB) DDR466 CL3 SDRAM
(Synchronous DRAM) memory modules. Total kit capacity is 512MB. The components on each
module include eight 32M x 8-bit (8M x 8-bit x 4 Bank) DDR466 SDRAM in TSOP packages. Each
184-pin DIMM uses gold contact fingers and requires +2.6V. The electrical and mechanical
specifications are as follows:
(Synchronous DRAM) memory modules. Total kit capacity is 512MB. The components on each
module include eight 32M x 8-bit (8M x 8-bit x 4 Bank) DDR466 SDRAM in TSOP packages. Each
184-pin DIMM uses gold contact fingers and requires +2.6V. The electrical and mechanical
specifications are as follows:
FEATURES:
Power supply : Vdd: 2.6V ± 0.1V, Vddq: 2.6V ± 0.1V
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
Programmable Read latency 3 (clock)
Programmable Burst length (2, 4, 8)
Programmable Burst type (sequential & interleave)
Timing Reference: 3-4-4-8-1 at +2.6V
Edge aligned data output, center aligned data input
Auto & Self refresh, 7.8us refresh interval (8K/64ms refresh)
Serial presence detect with EEPROM
High Performance Heat Spreader
PCB : Height 1.250” (31.75mm), single sided component
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
Programmable Read latency 3 (clock)
Programmable Burst length (2, 4, 8)
Programmable Burst type (sequential & interleave)
Timing Reference: 3-4-4-8-1 at +2.6V
Edge aligned data output, center aligned data input
Auto & Self refresh, 7.8us refresh interval (8K/64ms refresh)
Serial presence detect with EEPROM
High Performance Heat Spreader
PCB : Height 1.250” (31.75mm), single sided component
PERFORMANCE:
Clock Cycle Time (tCK)
5ns (min.) / 10ns (max.)
Row Cycle Time (tRC)
55ns (min.)
Refresh Row Cycle Time (tRFC) 70ns (min.)
Row Active Time (tRAS)
Row Active Time (tRAS)
40ns (min.) / 70,000ns (max.)
Power (IDD0)
2.184 W (operating per module)
UL Rating
94 V - 0
Operating Temperature
0
o
C to 70
o
C
Storage Temperature
-55
o
C to +150
o
C